Hologram, Inc.|Schede modulo di identificazione abbonato (SIM) - Page 1 - Fudong Communication (Shenzhen) Group Co., Ltd.

Numero parte produttore	Disponibilità	Prezzo	Quantità	Scheda tecnica	Packaging	Series	ProductStatus	Format	Class	Memory	CoreProcessor	CarrierNetwork	NetworkTechnology	Features	OperatingTemperature
SIM-E-TRI-GL-100 EUICC TRIPLE CUT SIM WITH GLOBAL Hologram, Inc.	2,833	-	RFQ	Scheda tecnica	Bulk	-	Active	3FF (Micro)	-	-	-	-	2G	-	-25°C ~ 85°C
SIM-E-MFF2-GL-250 EUICC MFF2 SIM WITH GLOBAL SIM P Hologram, Inc.	2,240	-	RFQ	Scheda tecnica	Tape & Reel (TR),Cut Tape (CT)	-	Active	-	-	-	-	-	-	-	-
SIM-N2-2FF3FF4FF GLOBAL IOT SIM 2FF/3FF/4FF Hologram, Inc.	2,195	-	RFQ	Scheda tecnica	Box	-	Obsolete	2FF (Mini), 3FF (Micro), 4FF (Nano)	-	-	-	-	2G, 3G, 4G LTE IOT	-	-
SIM-ST-MFF2 GLOBAL IOT EMBEDDED SIM CHIP Hologram, Inc.	2,440	-	RFQ	Scheda tecnica	Tape & Reel (TR),Cut Tape (CT)	-	Discontinued at Mosen	ESIM (MFF2)	-	-	-	-	2G, 3G, 4G LTE IOT	-	-
SIM-E-TRI-GL-1000 EUICC TRIPLE CUT SIM Hologram, Inc.	751	-	RFQ	Scheda tecnica	Bulk	-	Active	4FF (Nano)	-	-	-	-	2G	-	-25°C ~ 85°C
SIM-E-TRI-GL-10 EUICC TRIPLE CUT SIM Hologram, Inc.	3,989	-	RFQ	Scheda tecnica	Bulk	-	Discontinued at Mosen	2FF (Mini)	-	-	-	-	2G	-	-25°C ~ 85°C
SIM-E-MFF2-GL-1000 EUICC MFF2 SIM WITH GLOBAL SIM P Hologram, Inc.	2,137	-	RFQ	Scheda tecnica	Tape & Reel (TR)	-	Discontinued at Mosen	ESIM (MFF2)	-	-	-	-	2G	-	-25°C ~ 85°C