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Microcontrollore incorporato Microprocessore Moduli FPGA

Numero parte produttore	Disponibilità	Prezzo	Quantità	Scheda tecnica	Packaging	Series	RoHS	Speed	RAM Size	Flash Size	Part Status	Co-Processor	Connector Type	Core Processor	Size / Dimension	Module/Board Type	Operating Temperature
101-0522 IC MOD RABBIT 3000 44.2MHZ 768KB Digi	3,483	-	RFQ		Box	RabbitCore®	RoHS	44.2MHz	768KB	512KB	Obsolete	-	2 IDC Headers 2x17	Rabbit 3000	1.85" x 2.73" (47mm x 69mm)	MPU Core	0°C ~ 70°C
TE0803-03-4DE21-L MODULE SOM TE0803-03 Trenz Electronic GmbH	2,130	-	RFQ	Scheda tecnica	Bulk	TE0803	RoHS	-	4GB	128MB	Obsolete	-	B2B	Zynq UltraScale+ XCZU4EV-1SFVC784E	2.05" x 2.99" (52mm x 76mm)	MPU Core	0°C ~ 85°C
SOMAM3517-10-1780RJXR IC MOD CORTEX-A8 600MHZ 256MB Beacon EmbeddedWorks	2,202	-	RFQ	Scheda tecnica	Bulk	AM35x	RoHS	600MHz	256MB	512MB	Obsolete	-	Board-to-Board (BTB) Socket - 300	ARM® Cortex®-A8, AM3517	1.61" x 2.02" (40.9mm x 51.2mm)	MPU Core	-20°C ~ 70°C
MX10-U SOM MAX10 FPGA ARIES Embedded	2,617	-	RFQ	Scheda tecnica	Box		RoHS	-	128MB	4GB (NAND), 4MB (NOR)	Active	-	100 Pin	-	2.76" x 1.38" (70mm x 35mm)	FPGA Core	0°C ~ 70°C
101-0961 IC MOD RABBIT 3000 22.1MHZ 256KB Digi	2,482	-	RFQ	Scheda tecnica	Box	RabbitCore®	RoHS	22.1MHz	256KB	512KB (Internal), 1MB (External)	Obsolete	-	IDC Header 2x20	Rabbit 3000	1.2" x 2.95" (30mm x 75mm)	MPU Core	-40°C ~ 70°C
TE0803-02-04EG-1E3 IC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH	2,557	-	RFQ		Bulk	TE0803	RoHS	-	2GB	128MB	Obsolete	-	B2B	Zynq UltraScale+ XCZU4EG-1SFVC784E	2.05" x 2.99" (52mm x 76mm)	MPU Core	0°C ~ 85°C
SOMC6748-10-1602AHCR IC MOD TMS320C6748 300MHZ 128MB Beacon EmbeddedWorks	3,338	-	RFQ	Scheda tecnica	Bulk		RoHS	300MHz	128MB	8MB	Obsolete	-	Board-to-Board (BTB) Socket - 200	TMS320C6748	1.18" x 1.57" (30mm x 40mm)	DSP Core	0°C ~ 70°C
MYC-C7Z015-4E1D-766-I ARM & FPGA SOM,XILINX ZYNQ 7015, MYIR Tech Limited	3,018	-	RFQ	Scheda tecnica	Box	Zynq®-7000	RoHS	766MHz	1GB	4GB	Active	Zynq-7000 (Z-7015)	Board-to-Board (BTB) Socket	ARM® Cortex®-A9	2.95" x 2.17" (75mm x 55mm)	MPU, FPGA Core	-40°C ~ 85°C
101-1006 IC MOD RABBIT 3000 51.6MHZ 1MB Digi	3,077	-	RFQ		Box		RoHS	51.6MHz	1MB	512KB (Internal), 1MB (External)	Obsolete	-	IDC Header 2x25, 2x5, 1x3mm	Rabbit 3000	2.35" x 4" (60mm x 102mm)	MPU Core	-40°C ~ 70°C
TE0803-02-03-1EA-S IC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH	2,333	-	RFQ		Bulk	TE0803	RoHS	-	2GB	128MB	Obsolete	-	B2B	Zynq UltraScale+ XCZU3EG-1SFVC784E	2.05" x 2.99" (52mm x 76mm)	FPGA Core	0°C ~ 85°C
SOMOMAP3503-11-1670HFCR IC MOD CORTEX-A8 600MHZ 128MB Beacon EmbeddedWorks	2,434	-	RFQ	Scheda tecnica	Bulk	OMAP35x	RoHS	600MHz	128MB	256MB	Obsolete	-	Board-to-Board (BTB) Socket - 240	ARM® Cortex®-A8, OMAP3503	1.23" x 3.01" (31.2mm x 76.5mm)	MPU Core	0°C ~ 70°C
MCXL-S055BC-I SOM CYCLONE10LP FPGA ARIES Embedded	3,170	-	RFQ	Scheda tecnica	Box		RoHS	-	512MB	256MB	Active	-	221 Pin Header	-	3.54" x 1.46" (90mm x 37mm)	FPGA Core	-
101-1007 IC MOD RABBIT 3000 25.8MHZ 256KB Digi	2,548	-	RFQ		Box		RoHS	25.8MHz	256KB	512KB	Obsolete	-	IDC Header 2x25, 2x5, 1x3mm	Rabbit 3000	2.35" x 4" (60mm x 102mm)	MPU Core	-40°C ~ 70°C
TE0803-02-03EG-1EA IC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH	3,228	-	RFQ		Bulk	TE0803	RoHS	-	2GB	128MB	Obsolete	-	B2B	Zynq UltraScale+ XCZU3EG-1SFVC784E	2.05" x 2.99" (52mm x 76mm)	MPU Core	0°C ~ 85°C
SOMOMAP3503-11-1672IFCR IC MOD CORTEX-A8 600MHZ 128MB Beacon EmbeddedWorks	2,498	-	RFQ	Scheda tecnica	Bulk	OMAP35x	RoHS	600MHz	128MB	256MB (NAND), 8MB (NOR)	Obsolete	-	Board-to-Board (BTB) Socket - 240	ARM® Cortex®-A8, OMAP3503	1.23" x 3.01" (31.2mm x 76.5mm)	MPU Core	0°C ~ 70°C
MCXL-H055BBB-I SOM CYCLONE10LP FPGA ARIES Embedded	2,808	-	RFQ	Scheda tecnica	Box		RoHS	-	1GB	256MB	Active	-	221 Pin Header	-	3.54" x 1.46" (90mm x 37mm)	FPGA Core	-
101-1051 IC MOD RABBIT 3000 44.2MHZ 1MB Digi	2,543	-	RFQ		Box	RabbitCore®	RoHS	44.2MHz	1MB	512KB (Internal), 32MB (External)	Obsolete	-	2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card	Rabbit 3000	1.85" x 2.73" (47mm x 69mm)	MPU Core	0°C ~ 70°C
TE0803-02-03CG-1EA MODULE SOM TE0803-02 Trenz Electronic GmbH	2,290	-	RFQ		Bulk	TE0803	RoHS	-	-	-	Obsolete	-	B2B	-	2.05" x 2.99" (52mm x 76mm)	MPU Core	-
SOMOMAP3503-21-1670AGCR IC MOD CORTEX-A8 600MHZ 128MB Beacon EmbeddedWorks	3,824	-	RFQ	Scheda tecnica	Bulk	OMAP35x	RoHS	600MHz	128MB	256MB	Obsolete	-	Board-to-Board (BTB) Socket - 200	ARM® Cortex®-A8, OMAP3503	0.59" x 1.06" (15mm x 27mm)	MPU Core	0°C ~ 70°C
MA-XU3-2CG-1E-D10-R2 SOM ZYNQ US+ ZU2CG 1GB Enclustra FPGA Solutions	2,249	-	RFQ		Box		RoHS	533MHz, 1.333GHz	1GB	16GB	Active	-	SO-DIMM-200	ARM® Quad-/Dual-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU	2.66" x 1.18" (67.6mm x 30mm)	MPU, FPGA Core	0°C ~ 85°C