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Microcontrollore incorporato Microprocessore Moduli FPGA
| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | RoHS | Speed | RAM Size | Flash Size | Part Status | Co-Processor | Connector Type | Core Processor | Size / Dimension | Module/Board Type | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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TE0808-04-15-1EE-SIC MOD SOM MPSOC Trenz Electronic GmbH |
3,371 | - |
RFQ |
Scheda tecnica |
Bulk | TE0808 | RoHS | - | - | - | Obsolete | - | - | - | - | MPU Core | - |
|
|
TE0808-04-09EG-1EKIC MOD SOM MPSOC Trenz Electronic GmbH |
3,772 | - |
RFQ |
Scheda tecnica |
Bulk | TE0808 | RoHS | - | 2GB | 128MB | Obsolete | - | B2B | Zynq UltraScale+ XCZU9EG-1FFVC900E | 2.05" x 2.99" (52mm x 76mm) | MPU Core | 0°C ~ 85°C |
|
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TE0820-04-4AE21FAMOD MPSOC ZU4CG-1E 2GB DDR4 IND Trenz Electronic GmbH |
2,611 | - |
RFQ |
Bulk | TE0820 | RoHS | - | 2GB | 128MB | Obsolete | - | Samtec LSHM | Zynq UltraScale+ XCZU4CG-1SFVC784E | 1.97" x 1.57" (50mm x 40mm) | MPU Core | 0°C ~ 85°C | |
|
|
TE0820-04-3AE21FAMOD MPSOC ZU3CG-1E 2GB DDR4 IND Trenz Electronic GmbH |
2,456 | - |
RFQ |
Bulk | TE0820 | RoHS | - | 2GB | 128MB | Obsolete | - | Samtec LSHM | Zynq UltraScale+ XCZU3CG-1SFVC784E | 1.97" x 1.57" (50mm x 40mm) | MPU Core | 0°C ~ 85°C | |
|
|
TE0820-04-2BE21FLMOD MPSOC ZU2EG-1E 2GB DDR4 IND Trenz Electronic GmbH |
3,954 | - |
RFQ |
Bulk | TE0820 | RoHS | - | 2GB | 128MB | Obsolete | - | Samtec LSHM | Zynq UltraScale+ XCZU2EG-1SFVC784E | 1.97" x 1.57" (50mm x 40mm) | MPU Core | 0°C ~ 85°C | |
|
|
TE0820-04-3BE21FAMOD MPSOC ZU3EG-1E 2GB DDR4 IND Trenz Electronic GmbH |
2,055 | - |
RFQ |
Bulk | TE0820 | RoHS | - | 2GB | 128MB | Obsolete | - | Samtec LSHM | Zynq UltraScale+ XCZU3EG-1SFVC784E | 1.97" x 1.57" (50mm x 40mm) | MPU Core | 0°C ~ 85°C | |
|
|
TE0820-04-3BE21FLMOD MPSOC ZU3EG-1E 2GB DDR4 IND Trenz Electronic GmbH |
3,603 | - |
RFQ |
Bulk | TE0820 | RoHS | - | 2GB | 128MB | Obsolete | - | Samtec LSHM | Zynq UltraScale+ XCZU3EG-1SFVC784E | 1.97" x 1.57" (50mm x 40mm) | MPU Core | 0°C ~ 85°C | |
|
|
TE0820-04-2AE21FAMOD MPSOC ZU2CG-1E 2GB DDR4 IND Trenz Electronic GmbH |
2,765 | - |
RFQ |
Bulk | TE0820 | RoHS | - | 2GB | 128MB | Obsolete | - | Samtec LSHM | Zynq UltraScale+ XCZU2CG-1SFVC784E | 1.97" x 1.57" (50mm x 40mm) | MPU Core | 0°C ~ 85°C | |
|
TE0820-04-4DE21FAMOD MPSOC ZU4EV-1E 2GB DDR4 IND Trenz Electronic GmbH |
3,956 | - |
RFQ |
Bulk | TE0820 | RoHS | - | 2GB | 128MB | Obsolete | - | Samtec LSHM | Zynq UltraScale+ XCZU4EV-1SFVC784E | 1.97" x 1.57" (50mm x 40mm) | MPU Core | 0°C ~ 85°C | |
|
|
TE0820-04-2BE21FAMOD MPSOC ZU2EG-1E 2GB DDR4 IND Trenz Electronic GmbH |
3,781 | - |
RFQ |
Bulk | TE0820 | RoHS | - | 2GB | 128MB | Obsolete | - | Samtec LSHM | Zynq UltraScale+ XCZU2EG-1SFVC784E | 1.97" x 1.57" (50mm x 40mm) | MPU Core | 0°C ~ 85°C | |
|
|
TE0820-04-2AI21FAMOD MPSOC ZU2CG-1I 2GB DDR4 IND Trenz Electronic GmbH |
3,680 | - |
RFQ |
Bulk | TE0820 | RoHS | - | 2GB | 128MB | Obsolete | - | Samtec LSHM | Zynq UltraScale+ XCZU2CG-1SFVC784I | 1.97" x 1.57" (50mm x 40mm) | MPU Core | -40°C ~ 85°C | |
|
TE0715-04-15-1ICIC SOC MODULE 1GB DDR3L Trenz Electronic GmbH |
2,309 | - |
RFQ |
Bulk | TE0715 | RoHS | 125MHz | 1GB | 32MB | Obsolete | Zynq-7000 (Z-7015) | Samtec LSHM | ARM Cortex-A9 | 1.97" x 1.57" (50mm x 40mm) | MCU, FPGA | -40°C ~ 85°C | |
|
|
TE0715-04-51I33-ANIC SOC MODULE 1GB DDR3L Trenz Electronic GmbH |
3,336 | - |
RFQ |
Bulk | TE0715 | RoHS | 125MHz | 1GB | 32MB | Active | Zynq-7000 (Z-7015) | Samtec LSHM | ARM Cortex-A9 | 1.97" x 1.57" (50mm x 40mm) | MCU, FPGA | -40°C ~ 85°C | |
|
|
TE0715-04-73E33-AIC SOC MODULE 1GB DDR3L Trenz Electronic GmbH |
2,515 | - |
RFQ |
Bulk | TE0715 | RoHS | 125MHz | 1GB | 32MB | Active | Zynq-7000 (Z-7030) | Samtec LSHM | ARM Cortex-A9 | 1.97" x 1.57" (50mm x 40mm) | MCU, FPGA | -40°C ~ 85°C | |
|
|
TE0715-04-30-3EIC SOC MODULE 1GB DDR3L Trenz Electronic GmbH |
3,102 | - |
RFQ |
Bulk | TE0715 | RoHS | 125MHz | 1GB | 32MB | Obsolete | Zynq-7000 (Z-7030) | Samtec LSHM | ARM Cortex-A9 | 1.97" x 1.57" (50mm x 40mm) | MCU, FPGA | -40°C ~ 85°C | |
|
|
TE0715-04-30-1IAIC SOC MODULE 1GB DDR3L Trenz Electronic GmbH |
2,237 | - |
RFQ |
Bulk | TE0715 | RoHS | 125MHz | 1GB | 32MB | Obsolete | Zynq-7000 (Z-7030) | Samtec LSHM | ARM Cortex-A9 | 1.97" x 1.57" (50mm x 40mm) | MCU, FPGA | -40°C ~ 85°C | |
|
|
TE0715-04-52I33-AIC SOC MODULE 1GB DDR3L Trenz Electronic GmbH |
3,181 | - |
RFQ |
Bulk | TE0715 | RoHS | 125MHz | 1GB | 32MB | Active | Zynq-7000 (Z-7015) | Samtec LSHM | ARM Cortex-A9 | 1.97" x 1.57" (50mm x 40mm) | MCU, FPGA | -40°C ~ 85°C | |
|
TE0726-03RJIC MODULE ZYNQBERRY Trenz Electronic GmbH |
3,895 | - |
RFQ |
Bulk | TE0726 | RoHS | - | 128MB | 16MB | Obsolete | Zynq-7000 (Z-7010) | CSI, DSI | ARM Cortex-A9 | 1.18" x 1.57" (30mm x 40mm) | MCU, FPGA | 0°C ~ 70°C | |
|
|
TE0726-03-41I64-AIC MODULE ZYNQBERRY Trenz Electronic GmbH |
2,373 | - |
RFQ |
Bulk | TE0726 | RoHS | - | 512MB | 16MB | Active | Zynq-7000 (Z-7010) | CSI, DSI | ARM Cortex-A9 | 1.18" x 1.57" (30mm x 40mm) | MCU, FPGA | 0°C ~ 70°C | |
|
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TE0726-03IMIC MODULE ZYNQBERRY Trenz Electronic GmbH |
2,359 | - |
RFQ |
Bulk | TE0726 | RoHS | - | 512MB | 16MB | Obsolete | Zynq-7000 (Z-7010) | CSI, DSI | ARM Cortex-A9 | 1.18" x 1.57" (30mm x 40mm) | MCU, FPGA | 0°C ~ 70°C |
- 1500+ Media giornaliera RFQ
- 20,000.000 Unità prodotto standard
- 1800+ Produttori mondiali
- 15,000+ Magazzino in stock
