+86 075582561136
Carica BOM
Oscillatori
| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Package/Case | Packaging | Series | ProductStatus | BaseResonator | Type | Frequency | Function | Output | Voltage-Supply | FrequencyStability | AbsolutePullRange(APR) | OperatingTemperature | SpreadSpectrumBandwidth | Current-Supply(Max) | Ratings | MountingType | Size/Dimension |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
DSC6013JI2B-001.0000TMEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
2,144 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tape & Reel (TR) | DSC60XXB | Active | MEMS | XO (Standard) | 1 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | - | ±25ppm | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6013JI2B-032K768MEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
2,806 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tube | DSC60XXB | Active | MEMS | XO (Standard) | 32.768 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | - | ±25ppm | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6013JI2B-032K768TMEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
3,599 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tape & Reel (TR) | DSC60XXB | Active | MEMS | XO (Standard) | 32.768 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | - | ±25ppm | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6013JI2B-250K000MEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
3,576 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tube | DSC60XXB | Active | MEMS | XO (Standard) | 250 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | - | ±25ppm | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6013JI2B-250K000TMEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
3,085 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tape & Reel (TR) | DSC60XXB | Active | MEMS | XO (Standard) | 250 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | - | ±25ppm | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6013JI2B-432K000MEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
2,697 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tube | DSC60XXB | Active | MEMS | XO (Standard) | 432 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | - | ±25ppm | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6013JI2B-432K000TMEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
2,229 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tape & Reel (TR) | DSC60XXB | Active | MEMS | XO (Standard) | 432 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | - | ±25ppm | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6013JI2B-720K000MEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
3,054 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tube | DSC60XXB | Active | MEMS | XO (Standard) | 720 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | - | ±25ppm | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6013JI2B-720K000TMEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
2,585 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tape & Reel (TR) | DSC60XXB | Active | MEMS | XO (Standard) | 720 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | - | ±25ppm | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
DSC6101JI1B-024.0000MEMS OSC LVCMOS 50PPM 2.5X2.0MM Microchip Technology |
3,760 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tube | DSC61XXB | Active | MEMS | XO (Standard) | 24 MHz | Enable/Disable | CMOS | 1.8V ~ 3.3V | ±50ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6101JI1B-024.0000TMEMS OSC LVCMOS 50PPM 2.5X2.0MM Microchip Technology |
3,047 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 24 MHz | Enable/Disable | CMOS | 1.8V ~ 3.3V | ±50ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6111HI2B-032K768MEMS OSC LVCMOS 25PPM 1.6X1.2MM Microchip Technology |
3,953 | - |
RFQ |
Scheda tecnica |
4-VFLGA | Bag | DSC61XXB | Active | MEMS | XO (Standard) | 32.768 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6111HI2B-032K768TMEMS OSC LVCMOS 25PPM 1.6X1.2MM Microchip Technology |
2,625 | - |
RFQ |
Scheda tecnica |
4-VFLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 32.768 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6111HI2B-250K000MEMS OSC LVCMOS 25PPM 1.6X1.2MM Microchip Technology |
3,265 | - |
RFQ |
Scheda tecnica |
4-VFLGA | Bag | DSC61XXB | Active | MEMS | XO (Standard) | 250 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6111HI2B-250K000TMEMS OSC LVCMOS 25PPM 1.6X1.2MM Microchip Technology |
2,452 | - |
RFQ |
Scheda tecnica |
4-VFLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 250 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6111HI2B-432K000MEMS OSC LVCMOS 25PPM 1.6X1.2MM Microchip Technology |
2,465 | - |
RFQ |
Scheda tecnica |
4-VFLGA | Bag | DSC61XXB | Active | MEMS | XO (Standard) | 432 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6111HI2B-432K000TMEMS OSC LVCMOS 25PPM 1.6X1.2MM Microchip Technology |
2,970 | - |
RFQ |
Scheda tecnica |
4-VFLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 432 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6111HI2B-720K000MEMS OSC LVCMOS 25PPM 1.6X1.2MM Microchip Technology |
3,454 | - |
RFQ |
Scheda tecnica |
4-VFLGA | Bag | DSC61XXB | Active | MEMS | XO (Standard) | 720 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6111HI2B-720K000TMEMS OSC LVCMOS 25PPM 1.6X1.2MM Microchip Technology |
2,360 | - |
RFQ |
Scheda tecnica |
4-VFLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 720 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6111JI1B-024.0000MEMS OSC LVCMOS 50PPM 2.5X2.0MM Microchip Technology |
3,437 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tube | DSC61XXB | Active | MEMS | XO (Standard) | 24 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±50ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
- 1500+ Media giornaliera RFQ
- 20,000.000 Unità prodotto standard
- 1800+ Produttori mondiali
- 15,000+ Magazzino in stock
