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Oscillatori
| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Package/Case | Packaging | Series | ProductStatus | BaseResonator | Type | Frequency | Function | Output | Voltage-Supply | FrequencyStability | AbsolutePullRange(APR) | OperatingTemperature | SpreadSpectrumBandwidth | Current-Supply(Max) | Ratings | MountingType | Size/Dimension |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
DSC6111JE1B-033.3333TMEMS OSC ULTTA LOW POWET LVCMOS Microchip Technology |
3,410 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 33.3333 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±50ppm | - | -20°C ~ 70°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
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DSC6111JI1B-025.0000MEMS OSC ULTTA LOW POWET LVCMOS Microchip Technology |
2,244 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tube | DSC61XXB | Active | MEMS | XO (Standard) | 25 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±50ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6111JI1B-025.0000TMEMS OSC ULTTA LOW POWET LVCMOS Microchip Technology |
2,987 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 25 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±50ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6111JI1B-098.3040MEMS OSC ULTTA LOW POWET LVCMOS Microchip Technology |
2,203 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tube | DSC61XXB | Active | MEMS | XO (Standard) | 98.304 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±50ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6111JI1B-098.3040TMEMS OSC ULTTA LOW POWET LVCMOS Microchip Technology |
2,055 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 98.304 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±50ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6111JI2B-004K000MEMS OSC ULTTA LOW POWET LVCMOS Microchip Technology |
3,667 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tube | DSC61XXB | Active | MEMS | XO (Standard) | 4 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6111JI2B-004K000TMEMS OSC ULTTA LOW POWET LVCMOS Microchip Technology |
2,170 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 4 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6111JI2B-024.0000MEMS OSC ULTTA LOW POWET LVCMOS Microchip Technology |
3,848 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tube | DSC61XXB | Active | MEMS | XO (Standard) | 24 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6111JI2B-024.0000TMEMS OSC ULTTA LOW POWET LVCMOS Microchip Technology |
2,730 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 24 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6111MA3B-050.0000MEMS OSC ULTTA LOW POWET LVCMOS Microchip Technology |
2,106 | - |
RFQ |
Scheda tecnica |
4-VFLGA | Bag | DSC61XXB | Active | MEMS | XO (Standard) | 50 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±20ppm | - | -40°C ~ 125°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
|
DSC6111MA3B-050.0000TMEMS OSC ULTTA LOW POWET LVCMOS Microchip Technology |
2,341 | - |
RFQ |
Scheda tecnica |
4-VFLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 50 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±20ppm | - | -40°C ~ 125°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
|
DSC6112HI2B-004K000MEMS OSC ULTTA LOW POWET LVCMOS Microchip Technology |
3,386 | - |
RFQ |
Scheda tecnica |
4-VFLGA | Bag | DSC61XXB | Active | MEMS | XO (Standard) | 4 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6112HI2B-004K000TMEMS OSC ULTTA LOW POWET LVCMOS Microchip Technology |
3,907 | - |
RFQ |
Scheda tecnica |
4-VFLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 4 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6112JI1B-050.0000MEMS OSC ULTTA LOW POWET LVCMOS Microchip Technology |
3,378 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tube | DSC61XXB | Active | MEMS | XO (Standard) | 50 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±50ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6112JI1B-050.0000TMEMS OSC ULTTA LOW POWET LVCMOS Microchip Technology |
3,170 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 50 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±50ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6112JI2B-004K000MEMS OSC ULTTA LOW POWET LVCMOS Microchip Technology |
3,716 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tube | DSC61XXB | Active | MEMS | XO (Standard) | 4 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6112JI2B-004K000TMEMS OSC ULTTA LOW POWET LVCMOS Microchip Technology |
3,067 | - |
RFQ |
Scheda tecnica |
4-VLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 4 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6331MI2CB-008.0000SPTEAD SPECTTUM MEMS OSC +-1.0% Microchip Technology |
2,191 | - |
RFQ |
Scheda tecnica |
4-VFLGA | Bag | DSC63XXB | Active | MEMS | XO (Standard) | 8 MHz | - | LVCMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | ±1.00%, Center Spread | 3mA (Typ) | - | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
|
DSC6331MI2CB-008.0000TSPTEAD SPECTTUM MEMS OSC +-1.0% Microchip Technology |
3,750 | - |
RFQ |
Scheda tecnica |
4-VFLGA | Tape & Reel (TR) | DSC63XXB | Active | MEMS | XO (Standard) | 8 MHz | - | LVCMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | ±1.00%, Center Spread | 3mA (Typ) | - | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
|
DSC6331MI2DB-008.0000SPTEAD SPECTTUM MEMS OSC +-1.5% Microchip Technology |
2,180 | - |
RFQ |
Scheda tecnica |
4-VFLGA | Bag | DSC63XXB | Active | MEMS | XO (Standard) | 8 MHz | - | LVCMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | ±1.50%, Center Spread | 3mA (Typ) | - | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
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