Chi siamo
Fudong Communication (Shenzhen) Group Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Group Co., Ltd.[email protected]
Lingua
Carica BOM
Cart
Tutte le categorie

Connettori rettangolari - Intestazioni, prese, prese femmina

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
801-43-034-10-002000

801-43-034-10-002000

CONN RCPT 34POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp. 		3,580 -

RFQ

801-43-034-10-002000

Scheda tecnica

 Bulk 801 Active Receptacle Female Socket Board to Board 34 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.165 (4.20mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSM-112-L-DV-A

SSM-112-L-DV-A

CONN RCPT 24POS 0.1 GOLD SMD

Samtec Inc. 		3,338 -

RFQ

SSM-112-L-DV-A

Scheda tecnica

 Tube SSM Active Receptacle, Pass Through Female Socket Board to Board or Cable 24 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
CLM-111-02-F-D-A-P

CLM-111-02-F-D-A-P

CONN RCPT 22POS 0.039 GOLD SMD

Samtec Inc. 		3,946 -

RFQ

CLM-111-02-F-D-A-P

Scheda tecnica

 Tube CLM Active Receptacle Female Socket Board to Board 22 All 0.039 (1.00mm) 2 0.039 (1.00mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLT-107-02-S-D-BE

CLT-107-02-S-D-BE

CONN RCPT 14POS 0.079 GOLD SMD

Samtec Inc. 		3,718 -

RFQ

CLT-107-02-S-D-BE

Scheda tecnica

 Bulk CLT Active Receptacle, Bottom Entry Female Socket Board to Board 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.083 (2.10mm) - -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-114-44-L-S

ESQ-114-44-L-S

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc. 		2,753 -

RFQ

ESQ-114-44-L-S

Scheda tecnica

 Bulk ESQ Active Elevated Socket Forked Board to Board 14 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.735 (18.67mm) 0.180 (4.57mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-117-23-L-S

ESQ-117-23-L-S

CONN SOCKET 17POS 0.1 GOLD PCB

Samtec Inc. 		2,610 -

RFQ

ESQ-117-23-L-S

Scheda tecnica

 Bulk ESQ Active Elevated Socket Forked Board to Board 17 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.535 (13.60mm) 0.190 (4.83mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-113-34-T-D

ESQ-113-34-T-D

CONN SOCKET 26POS 0.1 TIN PCB

Samtec Inc. 		2,791 -

RFQ

ESQ-113-34-T-D

Scheda tecnica

 Tube ESQ Active Elevated Socket Forked Board to Board 26 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.635 (16.13mm) 0.280 (7.11mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-111-02-F-D-309

ESQT-111-02-F-D-309

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		2,125 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.309 (7.85mm) 0.541 (13.74mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-660

ESQT-111-02-F-D-660

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		2,252 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.660 (16.76mm) 0.190 (4.83mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-310

ESQT-111-02-F-D-310

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		2,883 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.310 (7.87mm) 0.540 (13.72mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-315

ESQT-111-02-F-D-315

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		3,661 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.315 (8.00mm) 0.535 (13.59mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-350

ESQT-111-02-F-D-350

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		3,656 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.350 (8.89mm) 0.500 (12.70mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-380

ESQT-111-02-F-D-380

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		3,296 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.380 (9.65mm) 0.470 (11.94mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-390

ESQT-111-02-F-D-390

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		3,513 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.390 (9.91mm) 0.460 (11.68mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-425

ESQT-111-02-F-D-425

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		3,676 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.425 (10.80mm) 0.425 (10.80mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-520

ESQT-111-02-F-D-520

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		3,843 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.520 (13.20mm) 0.330 (8.38mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-525

ESQT-111-02-F-D-525

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		2,186 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.525 (13.34mm) 0.325 (8.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-535

ESQT-111-02-F-D-535

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		3,399 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.535 (13.60mm) 0.315 (8.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-600

ESQT-111-02-F-D-600

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		2,438 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.600 (15.24mm) 0.250 (6.35mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-650

ESQT-111-02-F-D-650

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		3,995 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.650 (16.50mm) 0.200 (5.08mm) -55°C ~ 125°C UL94 V-0 Tin - -
Total 65534 Record«Prev1... 29632964296529662967296829692970...3277Next»
1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

Home

 Fudong Communication (Shenzhen) Group Co., Ltd.

Prodotto

 Fudong Communication (Shenzhen) Group Co., Ltd.

Telefono

 Fudong Communication (Shenzhen) Group Co., Ltd.

Utente