Chi siamo
Fudong Communication (Shenzhen) Group Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Group Co., Ltd.[email protected]
Lingua
Carica BOM
Cart
Tutte le categorie

Connettori rettangolari - Intestazioni, prese, prese femmina

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
ESQT-104-02-L-T-720

ESQT-104-02-L-T-720

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,901 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 3 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.720 (18.30mm) 0.130 (3.30mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-02-L-T-790

ESQT-104-02-L-T-790

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,560 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 3 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.790 (20.07mm) 0.060 (1.52mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-310

ESQT-108-02-L-D-310

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,098 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.310 (7.87mm) 0.540 (13.72mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-315

ESQT-108-02-L-D-315

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,809 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.315 (8.00mm) 0.535 (13.59mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-350

ESQT-108-02-L-D-350

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,752 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.350 (8.89mm) 0.500 (12.70mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-355

ESQT-108-02-L-D-355

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,331 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.355 (9.02mm) 0.495 (12.57mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-365

ESQT-108-02-L-D-365

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,400 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.365 (9.27mm) 0.485 (12.32mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-400

ESQT-108-02-L-D-400

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,009 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.400 (10.16mm) 0.450 (11.43mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-420

ESQT-108-02-L-D-420

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,843 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.420 (10.67mm) 0.430 (10.92mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-430

ESQT-108-02-L-D-430

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,188 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.430 (10.92mm) 0.420 (10.67mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-431

ESQT-108-02-L-D-431

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,413 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.431 (10.95mm) 0.419 (10.64mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-435

ESQT-108-02-L-D-435

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,498 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435 (11.05mm) 0.415 (10.54mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-440

ESQT-108-02-L-D-440

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,254 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.440 (11.18mm) 0.410 (10.41mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-446

ESQT-108-02-L-D-446

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,774 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.446 (11.33mm) 0.404 (10.26mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-448

ESQT-108-02-L-D-448

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,110 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.448 (11.38mm) 0.402 (10.21mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-475

ESQT-108-02-L-D-475

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,229 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.475 (12.07mm) 0.375 (9.53mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-485

ESQT-108-02-L-D-485

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,813 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.485 (12.32mm) 0.365 (9.27mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-490

ESQT-108-02-L-D-490

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,377 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.490 (12.44mm) 0.360 (9.14mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-500

ESQT-108-02-L-D-500

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,448 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.500 (12.70mm) 0.350 (8.89mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-502

ESQT-108-02-L-D-502

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,110 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.502 (12.75mm) 0.348 (8.84mm) -55°C ~ 125°C UL94 V-0 Tin - -
Total 38494 Record«Prev1... 16981699170017011702170317041705...1925Next»
1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

Home

 Fudong Communication (Shenzhen) Group Co., Ltd.

Prodotto

 Fudong Communication (Shenzhen) Group Co., Ltd.

Telefono

 Fudong Communication (Shenzhen) Group Co., Ltd.

Utente