Zoccoli per IC, transistor - Adattatori

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus ConvertFrom(AdapterEnd) ConvertTo(AdapterEnd) NumberofPins Pitch-Mating ContactFinish-Mating MountingType Termination Pitch-Post ContactFinish-Post HousingMaterial
08-665000-00

08-665000-00

SCK ADAPT 8P SOIC-W TO SOIC 0.6

Aries Electronics
2,283 -

RFQ

08-665000-00

Scheda tecnica

Bulk Correct-A-Chip® 665000 Active SOIC-W SOIC 8 0.050 (1.27mm) - Surface Mount Solder 0.050 (1.27mm) Tin-Lead -
224-1275-09-0602J

224-1275-09-0602J

SOCKET ADAPTER 24DIP TO 24DIP

3M
3,158 -

RFQ

224-1275-09-0602J

Scheda tecnica

Tube Textool™ Active DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing 24 0.100 (2.54mm) Gold Through Hole Solder 0.100 (2.54mm) Gold Polysulfone (PSU), Glass Filled
14-665000-00

14-665000-00

SCK ADAPT 14P SOIC-W TO SOIC 0.6

Aries Electronics
2,941 -

RFQ

14-665000-00

Scheda tecnica

Bulk Correct-A-Chip® 665000 Active SOIC-W SOIC 14 0.050 (1.27mm) - Surface Mount Solder 0.050 (1.27mm) Tin-Lead -
68-505-110-P

68-505-110-P

SOCKET ADAPTER PLCC TO 68PGA

Aries Electronics
3,232 -

RFQ

68-505-110-P

Scheda tecnica

Bulk Correct-A-Chip® 505 Active PLCC PGA 68 0.050 (1.27mm) - Through Hole Solder 0.050 (1.27mm) Tin-Lead -
18-351000-10

18-351000-10

SOCKET ADAPTER SSOP TO 18DIP 0.3

Aries Electronics
3,336 -

RFQ

18-351000-10

Scheda tecnica

Bulk Correct-A-Chip® 351000 Active SSOP DIP, 0.3 (7.62mm) Row Spacing 18 0.026 (0.65mm) - Through Hole Solder 0.100 (2.54mm) Tin-Lead -
PA-SOD6SM18-44

PA-SOD6SM18-44

ADAPTER 44SOIC TO 44DIP

Logical Systems Inc.
2,984 -

RFQ

PA-SOD6SM18-44

Scheda tecnica

Bulk - Active SOIC DIP 44 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) - -
18-35W000-11-RC

18-35W000-11-RC

SOCKET ADAPT SOIC-W TO 18DIP 0.3

Aries Electronics
2,912 -

RFQ

18-35W000-11-RC

Scheda tecnica

Bulk Correct-A-Chip® 35W000 Active SOIC-W DIP, 0.3 (7.62mm) Row Spacing 18 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) Gold -
24-35W000-11-RC

24-35W000-11-RC

SOCKET ADAPT SOIC-W TO 24DIP 0.3

Aries Electronics
3,608 -

RFQ

24-35W000-11-RC

Scheda tecnica

Bulk Correct-A-Chip® 35W000 Active SOIC-W DIP, 0.3 (7.62mm) Row Spacing 24 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) Gold -
18-351000-11-RC

18-351000-11-RC

SOCKET ADAPTER SSOP TO 18DIP 0.3

Aries Electronics
3,306 -

RFQ

18-351000-11-RC

Scheda tecnica

Tube Correct-A-Chip® 351000 Active SSOP DIP, 0.3 (7.62mm) Row Spacing 18 0.026 (0.65mm) Gold Through Hole Solder 0.100 (2.54mm) Gold -
28-35W000-11-RC

28-35W000-11-RC

SOCKET ADAPT SOIC-W TO 28DIP 0.3

Aries Electronics
3,703 -

RFQ

28-35W000-11-RC

Scheda tecnica

Bulk Correct-A-Chip® 35W000 Active SOIC-W DIP, 0.3 (7.62mm) Row Spacing 28 - - Through Hole Solder 0.050 (1.27mm) Gold -
24-351000-10

24-351000-10

SOCKET ADAPTER SSOP TO 24DIP 0.3

Aries Electronics
2,597 -

RFQ

24-351000-10

Scheda tecnica

Bulk Correct-A-Chip® 351000 Active SSOP DIP, 0.3 (7.62mm) Row Spacing 24 0.026 (0.65mm) - Through Hole Solder 0.100 (2.54mm) Tin-Lead -
20-351000-10

20-351000-10

SOCKET ADAPTER SSOP TO 20DIP 0.3

Aries Electronics
3,876 -

RFQ

20-351000-10

Scheda tecnica

Bulk Correct-A-Chip® 351000 Active SSOP DIP, 0.3 (7.62mm) Row Spacing 20 0.026 (0.65mm) - Through Hole Solder 0.100 (2.54mm) Tin-Lead -
24-351000-11-RC

24-351000-11-RC

SOCKET ADAPTER SSOP TO 24DIP 0.3

Aries Electronics
3,588 -

RFQ

24-351000-11-RC

Scheda tecnica

Bulk Correct-A-Chip® 351000 Active SSOP DIP, 0.3 (7.62mm) Row Spacing 24 0.026 (0.65mm) Gold Through Hole Solder 0.100 (2.54mm) Gold -
240-1280-39-0602J

240-1280-39-0602J

RECEPTACLE DIP SOCKET 40POS .6

3M
2,311 -

RFQ

240-1280-39-0602J

Scheda tecnica

Box Textool™ Active DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing 40 0.100 (2.54mm) Gold Through Hole Wire Wrap 0.100 (2.54mm) Gold Polysulfone (PSU), Glass Filled
08-354000-10

08-354000-10

CONN ADAPTER 8POS DIP-S01C

Aries Electronics
2,793 -

RFQ

Bulk Correct-A-Chip® 354000 Active DIP, 0.3 (7.62mm) Row Spacing SOIC 8 0.100 (2.54mm) Gold Surface Mount Solder 0.050 (1.27mm) Gold Polyamide (PA46), Nylon 4/6, Glass Filled
08-354000-11-RC

08-354000-11-RC

SOCKET ADAPTER DIP TO 8SOIC

Aries Electronics
3,033 -

RFQ

08-354000-11-RC

Scheda tecnica

Bulk Correct-A-Chip® 354000 Active DIP, 0.3 (7.62mm) Row Spacing SOIC 8 0.100 (2.54mm) Gold Surface Mount Solder 0.050 (1.27mm) Gold Polyamide (PA46), Nylon 4/6, Glass Filled
08-354000-21-RC

08-354000-21-RC

SOCKET ADAPTER DIP TO 8SOIC

Aries Electronics
2,784 -

RFQ

08-354000-21-RC

Scheda tecnica

Bulk Correct-A-Chip® 354000 Active DIP, 0.3 (7.62mm) Row Spacing SOIC 8 0.100 (2.54mm) Gold Surface Mount Solder 0.050 (1.27mm) Gold Polyamide (PA46), Nylon 4/6, Glass Filled
32-650000-10-P

32-650000-10-P

SOCKET ADAPTER SOIC TO 32DIP 0.6

Aries Electronics
2,823 -

RFQ

32-650000-10-P

Scheda tecnica

Tube Correct-A-Chip® 650000 Active SOIC DIP, 0.6 (15.24mm) Row Spacing 32 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) Tin-Lead -
14-354000-10

14-354000-10

SOCKET ADAPTER DIP TO 14SOIC

Aries Electronics
3,761 -

RFQ

14-354000-10

Scheda tecnica

Bulk Correct-A-Chip® 354000 Active DIP, 0.3 (7.62mm) Row Spacing SOIC 14 0.100 (2.54mm) Gold Surface Mount Solder 0.050 (1.27mm) Gold Polyamide (PA46), Nylon 4/6, Glass Filled
14-354000-20

14-354000-20

SOCKET ADAPTER DIP TO 14SOIC

Aries Electronics
2,338 -

RFQ

14-354000-20

Scheda tecnica

Bulk Correct-A-Chip® 354000 Active DIP, 0.3 (7.62mm) Row Spacing SOIC 14 0.100 (2.54mm) Gold Surface Mount Solder 0.050 (1.27mm) Gold Polyamide (PA46), Nylon 4/6, Glass Filled
Total 274 Record«Prev123456789...14Next»
1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

Home

Fudong Communication (Shenzhen) Group Co., Ltd.

Prodotto

Fudong Communication (Shenzhen) Group Co., Ltd.

Telefono

Fudong Communication (Shenzhen) Group Co., Ltd.

Utente