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| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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SIP050-1X14-160BLFCONN SOCKET SIP 14POS GOLD Amphenol ICC (FCI) |
3,337 | - |
RFQ |
Scheda tecnica |
Bulk | SIP050-1x | Obsolete | SIP | 14 (1 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SIP1X32-041BLFCONN SOCKET SIP 32POS GOLD Amphenol ICC (FCI) |
2,645 | - |
RFQ |
Scheda tecnica |
Bulk | SIP1x | Obsolete | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
SIP050-1X25-160BLFCONN SOCKET SIP 25POS GOLD Amphenol ICC (FCI) |
3,210 | - |
RFQ |
Scheda tecnica |
Bulk | SIP050-1x | Obsolete | SIP | 25 (1 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SIP050-1X32-157BLFCONN SOCKET SIP 32POS TIN Amphenol ICC (FCI) |
2,118 | - |
RFQ |
Scheda tecnica |
Bulk | SIP050-1x | Obsolete | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SIP050-1X16-157BLFCONN SOCKET SIP 16POS TIN Amphenol ICC (FCI) |
2,959 | - |
RFQ |
Scheda tecnica |
Bulk | SIP050-1x | Obsolete | SIP | 16 (1 x 16) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SIP050-1X24-157BLFCONN SOCKET SIP 24POS TIN Amphenol ICC (FCI) |
2,440 | - |
RFQ |
Scheda tecnica |
Bulk | SIP050-1x | Obsolete | SIP | 24 (1 x 24) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SIP050-1X05-157BLFCONN SOCKET SIP 5POS TIN Amphenol ICC (FCI) |
3,324 | - |
RFQ |
Scheda tecnica |
Bulk | SIP050-1x | Obsolete | SIP | 5 (1 x 5) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SIP050-1X20-160BLFCONN SOCKET SIP 20POS GOLD Amphenol ICC (FCI) |
3,302 | - |
RFQ |
Scheda tecnica |
Bulk | SIP050-1x | Obsolete | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SIP1X05-041BLFCONN SOCKET SIP 5POS GOLD Amphenol ICC (FCI) |
2,536 | - |
RFQ |
Scheda tecnica |
Bulk | SIP1x | Obsolete | SIP | 5 (1 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
DIP050-628-160BLFCONN IC DIP SOCKET 28POS GOLD Amphenol ICC (FCI) |
2,774 | - |
RFQ |
Scheda tecnica |
Bag | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SIP050-1X09-157BLFCONN SOCKET SIP 9POS TIN Amphenol ICC (FCI) |
2,264 | - |
RFQ |
Scheda tecnica |
Bulk | SIP050-1x | Obsolete | SIP | 9 (1 x 9) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SPF080-1X08-998ZCONN SOCKET SIP 8POS TIN-LEAD Amphenol ICC (FCI) |
2,997 | - |
RFQ |
Scheda tecnica |
- | SPF080-1x | Obsolete | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | - | Through Hole | Closed Frame | - | - | - | - | - | - |
|
|
SIP1X14-041BLFCONN SOCKET SIP 14POS GOLD Amphenol ICC (FCI) |
2,192 | - |
RFQ |
Scheda tecnica |
Bulk | SIP1x | Obsolete | SIP | 14 (1 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
SIP050-1X05-160BLFCONN SOCKET SIP 5POS GOLD Amphenol ICC (FCI) |
3,970 | - |
RFQ |
Scheda tecnica |
Bulk | SIP050-1x | Obsolete | SIP | 5 (1 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SIP1X30-041BLFCONN SOCKET SIP 30POS GOLD Amphenol ICC (FCI) |
3,276 | - |
RFQ |
Scheda tecnica |
Bulk | SIP1x | Obsolete | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
SIP050-1X06-157BLFCONN SOCKET SIP 6POS TIN Amphenol ICC (FCI) |
2,467 | - |
RFQ |
Scheda tecnica |
Bulk | SIP050-1x | Obsolete | SIP | 6 (1 x 6) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SIP050-1X10-157BLFCONN SOCKET SIP 10POS TIN Amphenol ICC (FCI) |
2,507 | - |
RFQ |
Scheda tecnica |
Bulk | SIP050-1x | Obsolete | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SIP050-1X09-160BLFCONN SOCKET SIP 9POS GOLD Amphenol ICC (FCI) |
3,136 | - |
RFQ |
Scheda tecnica |
Bulk | SIP050-1x | Obsolete | SIP | 9 (1 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SIP050-1X11-157BLFCONN SOCKET SIP 11POS TIN Amphenol ICC (FCI) |
2,157 | - |
RFQ |
Scheda tecnica |
Bulk | SIP050-1x | Obsolete | SIP | 11 (1 x 11) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SIP050-1X17-157BLFCONN SOCKET SIP 17POS TIN Amphenol ICC (FCI) |
3,378 | - |
RFQ |
Scheda tecnica |
Bulk | SIP050-1x | Obsolete | SIP | 17 (1 x 17) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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