+86 075582561136
Carica BOM
Zoccoli per IC, transistor
| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
D2816-42CONN IC DIP SOCKET 16POS GOLD Harwin Inc. |
2,027 | - |
RFQ |
Scheda tecnica |
Tube | D2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic |
|
D2808-42CONN IC DIP SOCKET 8POS GOLD Harwin Inc. |
1,677 | - |
RFQ |
Scheda tecnica |
Tube | D2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic |
|
D2820-42CONN IC DIP SOCKET 20POS GOLD Harwin Inc. |
2,815 | - |
RFQ |
Scheda tecnica |
Tube | D2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic |
|
D2814-42CONN IC DIP SOCKET 14POS GOLD Harwin Inc. |
1,186 | - |
RFQ |
Scheda tecnica |
Tube | D2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic |
|
D2828-42CONN IC DIP SOCKET 28POS GOLD Harwin Inc. |
3,759 | - |
RFQ |
Scheda tecnica |
Tube | D2 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic |
|
D01-9933246CONN SOCKET SIP 32POS TIN Harwin Inc. |
3,870 | - |
RFQ |
Scheda tecnica |
Bulk | D01-993 | Active | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Tin | - | Brass | Through Hole | - | Solder Cup | 0.100 (2.54mm) | Tin | - | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
D01-9970942CONN SOCKET SIP 9POS GOLD Harwin Inc. |
667 | - |
RFQ |
Scheda tecnica |
Tube | D01-997 | Active | SIP | 9 (1 x 9) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D01-9970342CONN SOCKET SIP 3POS GOLD Harwin Inc. |
3,974 | - |
RFQ |
Scheda tecnica |
Tube | D01-997 | Active | SIP | 3 (1 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D01-9970242CONN SOCKET SIP 2POS GOLD Harwin Inc. |
3,430 | - |
RFQ |
Scheda tecnica |
Bulk | D01-997 | Active | SIP | 2 (1 x 2) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Threaded | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D01-9970842CONN SOCKET SIP 8POS GOLD Harwin Inc. |
3,947 | - |
RFQ |
Scheda tecnica |
Tube | D01-997 | Active | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D01-9972142CONN SOCKET SIP 21POS GOLD Harwin Inc. |
2,449 | - |
RFQ |
Scheda tecnica |
Tube | D01-997 | Active | SIP | 21 (1 x 21) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D95008-42CONN IC DIP SOCKET 8POS GOLD Harwin Inc. |
2,773 | - |
RFQ |
Scheda tecnica |
Bulk | D95 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D2608-42CONN IC DIP SOCKET 8POS GOLD Harwin Inc. |
2,973 | - |
RFQ |
Scheda tecnica |
Tube | D26 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D2922-42CONN IC DIP SOCKET 22POS GOLD Harwin Inc. |
3,690 | - |
RFQ |
Scheda tecnica |
Tube | D2 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic |
|
|
D95014-42CONN IC DIP SOCKET 14POS GOLD Harwin Inc. |
2,699 | - |
RFQ |
Scheda tecnica |
Bulk | D95 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D01-9951442CONN SOCKET SIP 14POS GOLD Harwin Inc. |
2,445 | - |
RFQ |
Scheda tecnica |
Tube | D01-995 | Active | SIP | 14 (1 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
|
D95040-42CONN IC DIP SOCKET 42POS GOLD Harwin Inc. |
3,593 | - |
RFQ |
Scheda tecnica |
Bulk | D95 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D01-9500442CONN SOCKET SIP 4POS GOLD Harwin Inc. |
2,329 | - |
RFQ |
Scheda tecnica |
Bulk | D01-950 | Obsolete | SIP | 4 (1 x 4) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
|
D01-9500542CONN SOCKET SIP 5POS GOLD Harwin Inc. |
2,659 | - |
RFQ |
Scheda tecnica |
Tube | D01-950 | Obsolete | SIP | 5 (1 x 5) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
|
D01-9500642CONN SOCKET SIP 6POS GOLD Harwin Inc. |
2,308 | - |
RFQ |
Scheda tecnica |
Tube | D01-950 | Obsolete | SIP | 6 (1 x 6) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
- 1500+ Media giornaliera RFQ
- 20,000.000 Unità prodotto standard
- 1800+ Produttori mondiali
- 15,000+ Magazzino in stock
