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| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
518-77-456M26-001105CONN SOCKET PGA 456POS GOLD Preci-Dip |
3,998 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | PGA | 456 (26 x 26) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
514-83-520M31-001148CONN SOCKET BGA 520POS GOLD Preci-Dip |
3,102 | - |
RFQ |
Scheda tecnica |
Bulk | 514 | Active | BGA | 520 (31 x 31) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-87-652M35-001148CONN SOCKET BGA 652POS GOLD Preci-Dip |
2,851 | - |
RFQ |
Scheda tecnica |
Bulk | 514 | Active | BGA | 652 (35 x 35) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-520M31-001152BGA SOLDER TAIL Preci-Dip |
2,709 | - |
RFQ |
Scheda tecnica |
Bulk | 550 | Active | BGA | 520 (31 x 31) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
546-83-559-22-131147CONN SOCKET PGA 559POS GOLD Preci-Dip |
3,538 | - |
RFQ |
Scheda tecnica |
Bulk | 546 | Active | PGA | 559 (22 x 22) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-80-361-18-101135PGA SOLDER TAIL Preci-Dip |
3,561 | - |
RFQ |
Scheda tecnica |
Bulk | 550 | Active | PGA | 361 (18 x 18) | 0.050 (1.27mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
518-77-456M26-001106CONN SOCKET PGA 456POS GOLD Preci-Dip |
3,194 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | PGA | 456 (26 x 26) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
558-10-500M30-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
2,473 | - |
RFQ |
Scheda tecnica |
Bulk | 558 | Active | PGA | 500 (30 x 30) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
558-10-504M29-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
2,874 | - |
RFQ |
Scheda tecnica |
Bulk | 558 | Active | PGA | 504 (29 x 29) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
558-10-478M26-131104BGA SURFACE MOUNT 1.27MM Preci-Dip |
2,948 | - |
RFQ |
Scheda tecnica |
Bulk | 558 | Active | BGA | 478 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-478M26-131105CONN SOCKET PGA 478POS GOLD Preci-Dip |
2,122 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | PGA | 478 (26 x 26) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
558-10-480M29-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
3,762 | - |
RFQ |
Scheda tecnica |
Bulk | 558 | Active | BGA | 480 (29 x 29) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-480M29-001105CONN SOCKET PGA 480POS GOLD Preci-Dip |
2,447 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | PGA | 480 (29 x 29) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
518-77-478M26-131106CONN SOCKET PGA 478POS GOLD Preci-Dip |
3,932 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | PGA | 478 (26 x 26) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
558-10-520M31-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
3,430 | - |
RFQ |
Scheda tecnica |
Bulk | 558 | Active | PGA | 520 (31 x 31) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-480M29-001106CONN SOCKET PGA 480POS GOLD Preci-Dip |
3,353 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | PGA | 480 (29 x 29) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
514-83-560M33-001148CONN SOCKET BGA 560POS GOLD Preci-Dip |
2,318 | - |
RFQ |
Scheda tecnica |
Bulk | 514 | Active | BGA | 560 (33 x 33) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-560M33-001152BGA SOLDER TAIL Preci-Dip |
2,737 | - |
RFQ |
Scheda tecnica |
Bulk | 550 | Active | BGA | 560 (33 x 33) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
558-10-500M30-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
3,072 | - |
RFQ |
Scheda tecnica |
Bulk | 558 | Active | BGA | 500 (30 x 30) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-500M30-001105CONN SOCKET PGA 500POS GOLD Preci-Dip |
3,147 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | PGA | 500 (30 x 30) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
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