Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
115-87-424-41-001101

115-87-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,857 -

RFQ

Bulk 115 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-624-41-001101

115-87-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,522 -

RFQ

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-328-41-005101

110-87-328-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,096 -

RFQ

110-87-328-41-005101

Scheda tecnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-318-41-105101

110-87-318-41-105101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,507 -

RFQ

110-87-318-41-105101

Scheda tecnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-322-41-003101

115-87-322-41-003101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,244 -

RFQ

115-87-322-41-003101

Scheda tecnica

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-422-41-003101

115-87-422-41-003101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,699 -

RFQ

115-87-422-41-003101

Scheda tecnica

Bulk 115 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-306-11-001101

299-87-306-11-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,765 -

RFQ

299-87-306-11-001101

Scheda tecnica

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-316-41-117101

114-83-316-41-117101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,727 -

RFQ

114-83-316-41-117101

Scheda tecnica

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-316-41-134161

114-83-316-41-134161

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
3,340 -

RFQ

114-83-316-41-134161

Scheda tecnica

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-312-41-018101

116-83-312-41-018101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,521 -

RFQ

116-83-312-41-018101

Scheda tecnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-624-41-005101

117-87-624-41-005101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,359 -

RFQ

117-87-624-41-005101

Scheda tecnica

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-610-41-012101

116-83-610-41-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,042 -

RFQ

116-83-610-41-012101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-308-41-001101

116-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,132 -

RFQ

116-83-308-41-001101

Scheda tecnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-310-41-001101

121-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,534 -

RFQ

121-83-310-41-001101

Scheda tecnica

Bulk 121 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-316-41-134191

114-87-316-41-134191

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
3,275 -

RFQ

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-310-41-001101

123-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,783 -

RFQ

123-83-310-41-001101

Scheda tecnica

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-320-41-134191

114-87-320-41-134191

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,061 -

RFQ

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-210-41-001101

614-83-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,955 -

RFQ

614-83-210-41-001101

Scheda tecnica

Bulk 614 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-624-41-001101

110-87-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,591 -

RFQ

110-87-624-41-001101

Scheda tecnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-624-41-001151

110-87-624-41-001151

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,093 -

RFQ

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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