Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-83-628-41-105191

110-83-628-41-105191

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,201 -

RFQ

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-121-13-061101

510-87-121-13-061101

CONN SOCKET PGA 121POS GOLD

Preci-Dip
3,681 -

RFQ

510-87-121-13-061101

Scheda tecnica

Bulk 510 Active PGA 121 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-121-15-001101

510-87-121-15-001101

CONN SOCKET PGA 121POS GOLD

Preci-Dip
2,988 -

RFQ

510-87-121-15-001101

Scheda tecnica

Bulk 510 Active PGA 121 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-121-15-061101

510-87-121-15-061101

CONN SOCKET PGA 121POS GOLD

Preci-Dip
3,895 -

RFQ

510-87-121-15-061101

Scheda tecnica

Bulk 510 Active PGA 121 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-072-11-001101

510-83-072-11-001101

CONN SOCKET PGA 72POS GOLD

Preci-Dip
2,510 -

RFQ

510-83-072-11-001101

Scheda tecnica

Bulk 510 Active PGA 72 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-072-11-041101

510-83-072-11-041101

CONN SOCKET PGA 72POS GOLD

Preci-Dip
2,865 -

RFQ

510-83-072-11-041101

Scheda tecnica

Bulk 510 Active PGA 72 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-072-11-061101

510-83-072-11-061101

CONN SOCKET PGA 72POS GOLD

Preci-Dip
2,798 -

RFQ

510-83-072-11-061101

Scheda tecnica

Bulk 510 Active PGA 72 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-121-11-000101

510-87-121-11-000101

CONN SOCKET PGA 121POS GOLD

Preci-Dip
3,393 -

RFQ

510-87-121-11-000101

Scheda tecnica

Bulk 510 Active PGA 121 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-121-13-001101

510-87-121-13-001101

CONN SOCKET PGA 121POS GOLD

Preci-Dip
2,572 -

RFQ

510-87-121-13-001101

Scheda tecnica

Bulk 510 Active PGA 121 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-121-13-041101

510-87-121-13-041101

CONN SOCKET PGA 121POS GOLD

Preci-Dip
2,682 -

RFQ

510-87-121-13-041101

Scheda tecnica

Bulk 510 Active PGA 121 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-640-41-018101

116-83-640-41-018101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,694 -

RFQ

116-83-640-41-018101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-642-41-006101

116-83-642-41-006101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,424 -

RFQ

116-83-642-41-006101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-636-41-009101

116-87-636-41-009101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,586 -

RFQ

116-87-636-41-009101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-652-41-003101

116-87-652-41-003101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
2,132 -

RFQ

116-87-652-41-003101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-073-11-061101

510-83-073-11-061101

CONN SOCKET PGA 73POS GOLD

Preci-Dip
3,854 -

RFQ

510-83-073-11-061101

Scheda tecnica

Bulk 510 Active PGA 73 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-642-41-105161

110-83-642-41-105161

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,933 -

RFQ

110-83-642-41-105161

Scheda tecnica

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-318-41-013101

116-87-318-41-013101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,525 -

RFQ

116-87-318-41-013101

Scheda tecnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-320-11-001101

299-83-320-11-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,665 -

RFQ

299-83-320-11-001101

Scheda tecnica

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-124-13-041101

510-87-124-13-041101

CONN SOCKET PGA 124POS GOLD

Preci-Dip
3,981 -

RFQ

510-87-124-13-041101

Scheda tecnica

Bulk 510 Active PGA 124 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-322-41-004101

116-83-322-41-004101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,912 -

RFQ

116-83-322-41-004101

Scheda tecnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 7778798081828384...142Next»
1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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