Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
AR 28-HZL/01/7-TT

AR 28-HZL/01/7-TT

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components
10,783 -

RFQ

AR 28-HZL/01/7-TT

Scheda tecnica

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
54020-44030LF

54020-44030LF

CONN SOCKET PLCC 44POS TIN

Amphenol ICC (FCI)
2,767 -

RFQ

54020-44030LF

Scheda tecnica

Tube - Active PLCC 44 (4 x 11) 0.050 (1.27mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyphenylene Sulfide (PPS)
8468-11B1-RK-TP

8468-11B1-RK-TP

CONN SOCKET PLCC 68POS TIN

3M
2,572 -

RFQ

8468-11B1-RK-TP

Scheda tecnica

Tube 8400 Active PLCC 68 (4 x 17) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
110-44-648-41-001000

110-44-648-41-001000

CONN IC DIP SOCKET 48POS TIN

Mill-Max Manufacturing Corp.
275 -

RFQ

110-44-648-41-001000

Scheda tecnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-328-41-001000

110-93-328-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
180 -

RFQ

110-93-328-41-001000

Scheda tecnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
ICO-308-SGT

ICO-308-SGT

CONN IC DIP SOCKET 8POS GOLD

Samtec Inc.
2,865 -

RFQ

ICO-308-SGT

Scheda tecnica

Tube ICO Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
210-43-628-41-001000

210-43-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
382 -

RFQ

210-43-628-41-001000

Scheda tecnica

Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
AR 16-HZW/TN

AR 16-HZW/TN

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components
108 -

RFQ

AR 16-HZW/TN

Scheda tecnica

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
115-93-624-41-003000

115-93-624-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
158 -

RFQ

115-93-624-41-003000

Scheda tecnica

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-87-632-41-001101

110-87-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
4,744 -

RFQ

110-87-632-41-001101

Scheda tecnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-13-320-41-001000

110-13-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
118 -

RFQ

110-13-320-41-001000

Scheda tecnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
940-44-068-17-400000

940-44-068-17-400000

CONN SOCKET PLCC 68POS TIN

Mill-Max Manufacturing Corp.
1,503 -

RFQ

940-44-068-17-400000

Scheda tecnica

Tube 940 Active PLCC 68 (4 x 17) 0.050 (1.27mm) Tin 150.0µin (3.81µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-632-41-001000

110-93-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
504 -

RFQ

110-93-632-41-001000

Scheda tecnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
8484-11B1-RK-TP

8484-11B1-RK-TP

CONN SOCKET PLCC 84POS TIN

3M
2,289 -

RFQ

8484-11B1-RK-TP

Scheda tecnica

Tube 8400 Active PLCC 84 (4 x 21) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
214-44-632-01-670800

214-44-632-01-670800

CONN IC DIP SOCKET 32POS TIN

Mill-Max Manufacturing Corp.
581 -

RFQ

214-44-632-01-670800

Scheda tecnica

Tube 214 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-624-41-001000

111-43-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
126 -

RFQ

111-43-624-41-001000

Scheda tecnica

Tube 111 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-640-41-001000

110-41-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.
1,100 -

RFQ

110-41-640-41-001000

Scheda tecnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-87-640-41-001101

110-87-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
4,902 -

RFQ

110-87-640-41-001101

Scheda tecnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
A-CCS 068-G-T

A-CCS 068-G-T

CONN SOCKET PLCC 68POS GOLD

Assmann WSW Components
867 -

RFQ

A-CCS 068-G-T

Scheda tecnica

Tube - Active PLCC 68 (4 x 17) 0.050 (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT)
A-CCS 044-G-T

A-CCS 044-G-T

CONN SOCKET PLCC 44POS GOLD

Assmann WSW Components
5,659 -

RFQ

A-CCS 044-G-T

Scheda tecnica

Tube - Active PLCC 44 (4 x 11) 0.050 (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT)
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1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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