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| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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10-9513-11CONN IC DIP SOCKET 10POS GOLD Aries Electronics |
3,233 | - |
RFQ |
Scheda tecnica |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.9 (22.86mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
30-3513-10TCONN IC DIP SOCKET 30POS GOLD Aries Electronics |
2,129 | - |
RFQ |
Scheda tecnica |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 30 (2 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
APA-318-T-MADAPTER PLUG Samtec Inc. |
2,949 | - |
RFQ |
Tube | APA | Active | - | 18 (2 x 9) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
714-43-119-31-018000CONN SOCKET SIP 19POS GOLD Mill-Max Manufacturing Corp. |
2,358 | - |
RFQ |
Scheda tecnica |
Bulk | 714 | Active | SIP | 19 (1 x 19) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
612-83-950-41-001101CONN IC DIP SOCKET 50POS GOLD Preci-Dip |
2,942 | - |
RFQ |
Scheda tecnica |
Bulk | 612 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
APA-322-T-AADAPTER PLUG Samtec Inc. |
3,638 | - |
RFQ |
Bulk | APA | Active | - | 22 (2 x 11) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
|
APA-422-T-AADAPTER PLUG Samtec Inc. |
3,361 | - |
RFQ |
Bulk | APA | Active | - | 22 (2 x 11) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
|
510-87-175-15-061101CONN SOCKET PGA 175POS GOLD Preci-Dip |
3,891 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 175 (15 x 15) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-175-16-001101CONN SOCKET PGA 175POS GOLD Preci-Dip |
3,373 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 175 (16 x 16) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-175-16-071101CONN SOCKET PGA 175POS GOLD Preci-Dip |
3,191 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 175 (16 x 16) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-175-16-072101CONN SOCKET PGA 175POS GOLD Preci-Dip |
3,838 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 175 (16 x 16) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-83-964-41-001101CONN IC DIP SOCKET 64POS GOLD Preci-Dip |
3,617 | - |
RFQ |
Scheda tecnica |
Bulk | 614 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
24-3518-10HCONN IC DIP SOCKET 24POS GOLD Aries Electronics |
2,572 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
121-83-648-41-001101CONN IC DIP SOCKET 48POS GOLD Preci-Dip |
2,008 | - |
RFQ |
Scheda tecnica |
Bulk | 121 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-176-16-001101CONN SOCKET PGA 176POS GOLD Preci-Dip |
2,325 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 176 (16 x 16) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-176-16-071101CONN SOCKET PGA 176POS GOLD Preci-Dip |
3,601 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 176 (16 x 16) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-176-15-061101CONN SOCKET PGA 176POS GOLD Preci-Dip |
3,028 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 176 (15 x 15) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
ICO-624-SGTCONN IC DIP SOCKET 24POS GOLD Samtec Inc. |
2,337 | - |
RFQ |
Scheda tecnica |
Tube | ICO | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
|
10-6501-20CONN IC DIP SOCKET 10POS TIN Aries Electronics |
2,600 | - |
RFQ |
Scheda tecnica |
Bulk | 501 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-6501-30CONN IC DIP SOCKET 10POS TIN Aries Electronics |
3,992 | - |
RFQ |
Scheda tecnica |
Bulk | 501 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
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