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| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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510-83-144-13-041101CONN SOCKET PGA 144POS GOLD Preci-Dip |
2,085 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 144 (13 x 13) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
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115-93-304-41-001000CONN IC DIP SOCKET 4POS GOLD Mill-Max Manufacturing Corp. |
3,973 | - |
RFQ |
Scheda tecnica |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
115-43-304-41-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,611 | - |
RFQ |
Scheda tecnica |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
26-6513-11CONN IC DIP SOCKET 26POS GOLD Aries Electronics |
2,136 | - |
RFQ |
Scheda tecnica |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.6 (15.24mm) Row Spacing | 26 (2 x 13) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
28-6518-10HCONN IC DIP SOCKET 28POS GOLD Aries Electronics |
3,847 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-820-90WRCONN IC DIP SOCKET 8POS GOLD Aries Electronics |
2,825 | - |
RFQ |
Scheda tecnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
|
824-AG30DCONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
2,585 | - |
RFQ |
Scheda tecnica |
Tube | 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
|
APA-308-G-PADAPTER PLUG Samtec Inc. |
2,449 | - |
RFQ |
Tube | APA | Active | - | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
116-83-650-41-001101CONN IC DIP SOCKET 50POS GOLD Preci-Dip |
2,489 | - |
RFQ |
Scheda tecnica |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
22-0513-11HCONN SOCKET SIP 22POS GOLD Aries Electronics |
3,100 | - |
RFQ |
Scheda tecnica |
Bulk | 0513 | Active | SIP | 22 (1 x 22) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
28-C212-10CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
2,034 | - |
RFQ |
Scheda tecnica |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
28-C300-10CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
2,871 | - |
RFQ |
Scheda tecnica |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
APA-318-T-PADAPTER PLUG Samtec Inc. |
2,251 | - |
RFQ |
Tube | APA | Active | - | 18 (2 x 9) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
|
APA-324-T-MADAPTER PLUG Samtec Inc. |
2,645 | - |
RFQ |
Tube | APA | Active | - | 24 (2 x 12) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
|
APA-624-T-MADAPTER PLUG Samtec Inc. |
2,468 | - |
RFQ |
Tube | APA | Active | - | 24 (2 x 12) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
|
510-83-136-14-051101CONN SOCKET PGA 136POS GOLD Preci-Dip |
2,407 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 136 (14 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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|
346-43-138-41-013000CONN SOCKET SIP 38POS GOLD Mill-Max Manufacturing Corp. |
2,631 | - |
RFQ |
Scheda tecnica |
Bulk | 346 | Active | SIP | 38 (1 x 38) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
40-3513-10CONN IC DIP SOCKET 40POS GOLD Aries Electronics |
3,932 | - |
RFQ |
Scheda tecnica |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-810-90TCONN IC DIP SOCKET 8POS TIN Aries Electronics |
3,770 | - |
RFQ |
Scheda tecnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
|
124-83-648-41-002101CONN IC DIP SOCKET 48POS GOLD Preci-Dip |
3,051 | - |
RFQ |
Bulk | 124 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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