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| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NTE417SOCKET-3-PIN TO-18 NTE Electronics, Inc |
3,444 | - |
RFQ |
Scheda tecnica |
Bulk | - | Active | Transistor, TO-18 and TO-92 | 3 (Round) | - | - | - | - | - | - | Solder | - | - | - | - | - |
|
ICF-628-T-OCONN IC DIP SOCKET 28POS TIN Samtec Inc. |
245 | - |
RFQ |
Scheda tecnica |
Tube | iCF | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) |
|
ICA-324-SST.100 SCREW MACHINE DIP SOCKET Samtec Inc. |
930 | - |
RFQ |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | |
|
ICO-320-SGTCONN IC DIP SOCKET 20POS GOLD Samtec Inc. |
840 | - |
RFQ |
Tube | ICO | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | |
|
ICA-632-SSTCONN IC DIP SOCKET 32POS GOLD Samtec Inc. |
364 | - |
RFQ |
Scheda tecnica |
Tube | ICA | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled |
|
ICA-316-ZAGTCONN IC DIP SOCKET 16POS GOLD Samtec Inc. |
163 | - |
RFQ |
Scheda tecnica |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled |
|
ICO-316-NGT100 LOW PROFILE SCREW MACHINE D Samtec Inc. |
249 | - |
RFQ |
Tube | ICO | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | |
|
APA-316-G-A1ADAPTER PLUG Samtec Inc. |
200 | - |
RFQ |
Bulk | APA | Active | - | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
D8864-42CONN IC DIP SOCKET 64POS GOLD Harwin Inc. |
432 | - |
RFQ |
Scheda tecnica |
Tube | D8864 | Active | DIP, 0.75 (19.05mm) Row Spacing | 64 (2 x 32) | 0.070 (1.78mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
ICO-628-NGTCONN IC DIP SOCKET 28POS GOLD Samtec Inc. |
121 | - |
RFQ |
Scheda tecnica |
Tube | ICO | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
48-6554-11CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics |
620 | - |
RFQ |
Scheda tecnica |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
115-47-308-41-003000CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp. |
1,377 | - |
RFQ |
Scheda tecnica |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
114-87-310-41-134191CONN IC DIP SOCKET 10POS GOLD Preci-Dip |
1,998 | - |
RFQ |
Tape & Reel (TR),Cut Tape (CT) | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
4-1571552-2CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
1,704 | - |
RFQ |
Scheda tecnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
808-AG11D-LFCONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
2,657 | - |
RFQ |
Scheda tecnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
2-1571551-2CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
4,214 | - |
RFQ |
Scheda tecnica |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
69802-144LFCONN SOCKET PLCC 44POS TIN Amphenol ICC (FCI) |
2,485 | - |
RFQ |
Scheda tecnica |
Tube | - | Active | PLCC | 44 (4 x 11) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS) |
|
520-AG11D-ESDIP SOCKET T/H 20POS TE Connectivity AMP Connectors |
867 | - |
RFQ |
Scheda tecnica |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
14-8870-10CONN IC DIP SOCKET 14POS TIN Aries Electronics |
700 | - |
RFQ |
Scheda tecnica |
Bulk | 8 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
4-1571552-6CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors |
1,786 | - |
RFQ |
Scheda tecnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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