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| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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14-820-90CONN IC DIP SOCKET 14POS GOLD Aries Electronics |
3,965 | - |
RFQ |
Scheda tecnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
116-83-648-41-004101CONN IC DIP SOCKET 48POS GOLD Preci-Dip |
3,676 | - |
RFQ |
Scheda tecnica |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
22-3513-11HCONN IC DIP SOCKET 22POS GOLD Aries Electronics |
2,483 | - |
RFQ |
Scheda tecnica |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
17-0503-20CONN SOCKET SIP 17POS GOLD Aries Electronics |
3,387 | - |
RFQ |
Scheda tecnica |
Bulk | 0503 | Active | SIP | 17 (1 x 17) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
17-0503-30CONN SOCKET SIP 17POS GOLD Aries Electronics |
3,488 | - |
RFQ |
Scheda tecnica |
Bulk | 0503 | Active | SIP | 17 (1 x 17) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
510-83-196-14-000101CONN SOCKET PGA 196POS GOLD Preci-Dip |
3,278 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 196 (14 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
38-0511-10CONN SOCKET SIP 38POS TIN Aries Electronics |
3,928 | - |
RFQ |
Scheda tecnica |
Bulk | 511 | Active | SIP | 38 (1 x 38) | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-3518-10ECONN IC DIP SOCKET 24POS GOLD Aries Electronics |
3,805 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
21-0508-20CONN SOCKET SIP 21POS GOLD Aries Electronics |
3,239 | - |
RFQ |
Scheda tecnica |
Bulk | 508 | Active | SIP | 21 (1 x 21) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
21-0508-30CONN SOCKET SIP 21POS GOLD Aries Electronics |
2,780 | - |
RFQ |
Scheda tecnica |
Bulk | 508 | Active | SIP | 21 (1 x 21) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
510-87-279-19-081101CONN SOCKET PGA 279POS GOLD Preci-Dip |
2,184 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 279 (19 x 19) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
11-0501-20CONN SOCKET SIP 11POS TIN Aries Electronics |
2,582 | - |
RFQ |
Scheda tecnica |
Bulk | 501 | Active | SIP | 11 (1 x 11) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
11-0501-30CONN SOCKET SIP 11POS TIN Aries Electronics |
2,355 | - |
RFQ |
Scheda tecnica |
Bulk | 501 | Active | SIP | 11 (1 x 11) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
16-C280-11HCONN IC DIP SOCKET 16POS GOLD Aries Electronics |
2,031 | - |
RFQ |
Scheda tecnica |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
546-83-085-11-002135CONN SOCKET PGA 85POS GOLD Preci-Dip |
3,088 | - |
RFQ |
Scheda tecnica |
Bulk | 546 | Active | PGA | 85 (11 x 11) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-83-085-11-002136CONN SOCKET PGA 85POS GOLD Preci-Dip |
3,349 | - |
RFQ |
Scheda tecnica |
Bulk | 546 | Active | PGA | 85 (11 x 11) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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|
346-93-153-41-013000CONN SOCKET SIP 53POS GOLD Mill-Max Manufacturing Corp. |
3,481 | - |
RFQ |
Scheda tecnica |
Bulk | 346 | Active | SIP | 53 (1 x 53) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
346-43-153-41-013000CONN SOCKET SIP 53POS GOLD Mill-Max Manufacturing Corp. |
3,359 | - |
RFQ |
Scheda tecnica |
Bulk | 346 | Active | SIP | 53 (1 x 53) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
16-6511-11CONN IC DIP SOCKET 16POS GOLD Aries Electronics |
2,350 | - |
RFQ |
Scheda tecnica |
Bulk | 511 | Active | DIP, 0.6 (15.24mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
714-43-136-31-018000CONN SOCKET SIP 36POS GOLD Mill-Max Manufacturing Corp. |
3,675 | - |
RFQ |
Scheda tecnica |
Bulk | 714 | Active | SIP | 36 (1 x 36) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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