Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
114-47-328-41-117000

114-47-328-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
2,030 -

RFQ

114-47-328-41-117000

Scheda tecnica

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-47-428-41-117000

114-47-428-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
3,918 -

RFQ

114-47-428-41-117000

Scheda tecnica

Tube 114 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-47-628-41-117000

114-47-628-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
3,500 -

RFQ

114-47-628-41-117000

Scheda tecnica

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-314-41-105000

110-41-314-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,748 -

RFQ

110-41-314-41-105000

Scheda tecnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-314-41-105000

110-91-314-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,236 -

RFQ

110-91-314-41-105000

Scheda tecnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-41-320-41-013000

146-41-320-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.
3,939 -

RFQ

146-41-320-41-013000

Scheda tecnica

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-91-320-41-013000

146-91-320-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.
2,986 -

RFQ

146-91-320-41-013000

Scheda tecnica

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-41-620-41-005000

117-41-620-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,115 -

RFQ

117-41-620-41-005000

Scheda tecnica

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-91-620-41-005000

117-91-620-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,614 -

RFQ

117-91-620-41-005000

Scheda tecnica

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
15-0508-21

15-0508-21

CONN SOCKET SIP 15POS GOLD

Aries Electronics
3,725 -

RFQ

15-0508-21

Scheda tecnica

Bulk 508 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
15-0508-31

15-0508-31

CONN SOCKET SIP 15POS GOLD

Aries Electronics
2,785 -

RFQ

15-0508-31

Scheda tecnica

Bulk 508 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
28-C182-11H

28-C182-11H

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
2,749 -

RFQ

28-C182-11H

Scheda tecnica

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
310-91-120-41-001000

310-91-120-41-001000

SOCKET SOLDERTAIL SIP 20POS

Mill-Max Manufacturing Corp.
3,390 -

RFQ

Tube 310 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-83-281-19-081101

510-83-281-19-081101

CONN SOCKET PGA 281POS GOLD

Preci-Dip
2,703 -

RFQ

510-83-281-19-081101

Scheda tecnica

Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-11-314-41-001000

110-11-314-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,346 -

RFQ

110-11-314-41-001000

Scheda tecnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-318-41-605000

110-41-318-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,622 -

RFQ

110-41-318-41-605000

Scheda tecnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-318-41-605000

110-91-318-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,070 -

RFQ

110-91-318-41-605000

Scheda tecnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-93-320-41-117000

114-93-320-41-117000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
3,485 -

RFQ

114-93-320-41-117000

Scheda tecnica

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-93-420-41-117000

114-93-420-41-117000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
2,214 -

RFQ

114-93-420-41-117000

Scheda tecnica

Tube 114 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-43-320-41-117000

114-43-320-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,617 -

RFQ

114-43-320-41-117000

Scheda tecnica

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Record«Prev1... 340341342343344345346347...1100Next»
1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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Fudong Communication (Shenzhen) Group Co., Ltd.

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