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| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
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20-6820-90CCONN IC DIP SOCKET 20POS GOLD Aries Electronics |
3,832 | - |
RFQ |
Scheda tecnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
20-6822-90CCONN IC DIP SOCKET 20POS GOLD Aries Electronics |
3,574 | - |
RFQ |
Scheda tecnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
20-6823-90CCONN IC DIP SOCKET 20POS GOLD Aries Electronics |
2,375 | - |
RFQ |
Scheda tecnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
20-8865-310CCONN ELEVATOR SOCKET 20 PO .300 Aries Electronics |
3,771 | - |
RFQ |
- | 8 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
|
|
48-6501-20CONN IC DIP SOCKET 48POS TIN Aries Electronics |
3,178 | - |
RFQ |
Scheda tecnica |
Bulk | 501 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
48-6501-30CONN IC DIP SOCKET 48POS TIN Aries Electronics |
2,620 | - |
RFQ |
Scheda tecnica |
Bulk | 501 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
14-6503-21CONN IC DIP SOCKET 14POS GOLD Aries Electronics |
3,563 | - |
RFQ |
Scheda tecnica |
Bulk | 503 | Active | DIP, 0.6 (15.24mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
14-6503-31CONN IC DIP SOCKET 14POS GOLD Aries Electronics |
3,956 | - |
RFQ |
Scheda tecnica |
Bulk | 503 | Active | DIP, 0.6 (15.24mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
20-9503-20CONN IC DIP SOCKET 20POS GOLD Aries Electronics |
3,862 | - |
RFQ |
Scheda tecnica |
Bulk | 503 | Active | DIP, 0.9 (22.86mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
20-9503-30CONN IC DIP SOCKET 20POS GOLD Aries Electronics |
3,234 | - |
RFQ |
Scheda tecnica |
Bulk | 503 | Active | DIP, 0.9 (22.86mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
25-0503-20CONN SOCKET SIP 25POS GOLD Aries Electronics |
2,581 | - |
RFQ |
Scheda tecnica |
Bulk | 0503 | Active | SIP | 25 (1 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
50-9518-10HCONN IC DIP SOCKET 50POS GOLD Aries Electronics |
3,204 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
16-71000-10CONN SOCKET SIP 16POS TIN Aries Electronics |
2,014 | - |
RFQ |
Scheda tecnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 16 (1 x 16) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
16-7415-10CONN SOCKET SIP 16POS TIN Aries Electronics |
2,766 | - |
RFQ |
Scheda tecnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 16 (1 x 16) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
09-0511-11CONN SOCKET SIP 9POS GOLD Aries Electronics |
3,391 | - |
RFQ |
Scheda tecnica |
Bulk | 511 | Active | SIP | 9 (1 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
24-516-11CONN IC DIP SOCKET ZIF 24POS GLD Aries Electronics |
3,325 | - |
RFQ |
Scheda tecnica |
Bulk | 516 | Active | DIP, ZIF (ZIP) | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-516-11SCONN IC DIP SOCKET ZIF 24POS GLD Aries Electronics |
3,183 | - |
RFQ |
Scheda tecnica |
Bulk | 516 | Active | DIP, ZIF (ZIP) | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-516-11MCONN IC DIP SOCKET ZIF 24POS GLD Aries Electronics |
3,939 | - |
RFQ |
Scheda tecnica |
Bulk | 516 | Active | DIP, ZIF (ZIP) | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
30-0508-20CONN SOCKET SIP 30POS GOLD Aries Electronics |
2,970 | - |
RFQ |
Scheda tecnica |
Bulk | 508 | Active | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
30-0508-30CONN SOCKET SIP 30POS GOLD Aries Electronics |
3,584 | - |
RFQ |
Scheda tecnica |
Bulk | 508 | Active | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 |
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