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| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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156-PRS16011-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,012 | - |
RFQ |
Scheda tecnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
168-PLS17011-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,433 | - |
RFQ |
Scheda tecnica |
Bulk | PLS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
168-PRS17011-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,128 | - |
RFQ |
Scheda tecnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
172-PLS16002-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,343 | - |
RFQ |
Scheda tecnica |
Bulk | PLS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
172-PRS16002-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,328 | - |
RFQ |
Scheda tecnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
24-3574-18CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics |
3,612 | - |
RFQ |
Scheda tecnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
24-6574-18CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics |
3,077 | - |
RFQ |
Scheda tecnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
24-6570-18CONN IC DIP SOCKET ZIF 24POS Aries Electronics |
2,546 | - |
RFQ |
Scheda tecnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
80-PRS21027-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,502 | - |
RFQ |
Scheda tecnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
175-PRS16005-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,870 | - |
RFQ |
Scheda tecnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
28-3551-18CONN IC DIP SOCKET ZIF 28POS Aries Electronics |
2,844 | - |
RFQ |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | |
|
|
28-3552-18CONN IC DIP SOCKET ZIF 28POS Aries Electronics |
2,612 | - |
RFQ |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | |
|
|
28-3553-18CONN IC DIP SOCKET ZIF 28POS Aries Electronics |
2,529 | - |
RFQ |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | |
|
|
28-6551-18CONN IC DIP SOCKET ZIF 28POS Aries Electronics |
2,807 | - |
RFQ |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | |
|
|
28-6552-18CONN IC DIP SOCKET ZIF 28POS Aries Electronics |
2,449 | - |
RFQ |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | |
|
|
28-6553-18CONN IC DIP SOCKET ZIF 32POS TIN Aries Electronics |
3,822 | - |
RFQ |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
28-3554-18CONN IC DIP SOCKET ZIF 24POS Aries Electronics |
3,763 | - |
RFQ |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | |
|
|
132-PRS14033-12PGA ZIF TEST/BURN-IN SOCKET Aries Electronics |
3,348 | - |
RFQ |
- | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | |
|
|
192-PRS17027-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,452 | - |
RFQ |
Scheda tecnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
24-3575-18CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics |
3,214 | - |
RFQ |
Scheda tecnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
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