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| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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20-4518-11CONN IC DIP SOCKET 20POS GOLD Aries Electronics |
2,647 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | DIP, 0.4 (10.16mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
30-0518-10HCONN SOCKET SIP 30POS GOLD Aries Electronics |
3,507 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
30-1518-10HCONN IC DIP SOCKET 30POS GOLD Aries Electronics |
3,583 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 30 (2 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
36-0518-10CONN SOCKET SIP 36POS GOLD Aries Electronics |
3,394 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | SIP | 36 (1 x 36) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
36-1518-10CONN IC DIP SOCKET 36POS GOLD Aries Electronics |
2,222 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
33-0518-10TCONN SOCKET SIP 33POS GOLD Aries Electronics |
3,032 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | SIP | 33 (1 x 33) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
48-6518-10TCONN IC DIP SOCKET 48POS GOLD Aries Electronics |
3,277 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
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28-6513-10TCONN IC DIP SOCKET 28POS GOLD Aries Electronics |
3,290 | - |
RFQ |
Scheda tecnica |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-3513-10CONN IC DIP SOCKET 24POS GOLD Aries Electronics |
2,029 | - |
RFQ |
Scheda tecnica |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
14-C280-10CONN IC DIP SOCKET 14POS GOLD Aries Electronics |
3,912 | - |
RFQ |
Scheda tecnica |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-3503-20CONN IC DIP SOCKET 8POS GOLD Aries Electronics |
3,743 | - |
RFQ |
Scheda tecnica |
Bulk | 503 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-3503-30CONN IC DIP SOCKET 8POS GOLD Aries Electronics |
2,977 | - |
RFQ |
Scheda tecnica |
Bulk | 503 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
14-C195-10CONN IC DIP SOCKET 14POS GOLD Aries Electronics |
3,654 | - |
RFQ |
Scheda tecnica |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-2823-90TCONN IC DIP SOCKET 8POS TIN Aries Electronics |
3,342 | - |
RFQ |
Scheda tecnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.2 (5.08mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
|
19-0513-10HCONN SOCKET SIP 19POS GOLD Aries Electronics |
2,305 | - |
RFQ |
Scheda tecnica |
Bulk | 0513 | Active | SIP | 19 (1 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
15-0518-11HCONN SOCKET SIP 15POS GOLD Aries Electronics |
3,396 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | SIP | 15 (1 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
42-1518-10TCONN IC DIP SOCKET 42POS GOLD Aries Electronics |
2,064 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
20-3518-10HCONN IC DIP SOCKET 20POS GOLD Aries Electronics |
2,030 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-3501-20CONN IC DIP SOCKET 8POS TIN Aries Electronics |
3,709 | - |
RFQ |
Scheda tecnica |
Bulk | 501 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-3501-30CONN IC DIP SOCKET 8POS TIN Aries Electronics |
2,551 | - |
RFQ |
Scheda tecnica |
Bulk | 501 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
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