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| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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08-2820-90CONN IC DIP SOCKET 8POS GOLD Aries Electronics |
2,408 | - |
RFQ |
Scheda tecnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.2 (5.08mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
08-6820-90CCONN IC DIP SOCKET 8POS GOLD Aries Electronics |
3,023 | - |
RFQ |
Scheda tecnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-6823-90CCONN IC DIP SOCKET 8POS GOLD Aries Electronics |
3,893 | - |
RFQ |
Scheda tecnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
28-3518-10HCONN IC DIP SOCKET 28POS GOLD Aries Electronics |
2,353 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
14-6501-20CONN IC DIP SOCKET 14POS TIN Aries Electronics |
3,104 | - |
RFQ |
Scheda tecnica |
Bulk | 501 | Active | DIP, 0.6 (15.24mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
28-C212-10TCONN IC DIP SOCKET 28POS TIN Aries Electronics |
3,946 | - |
RFQ |
Scheda tecnica |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-6822-90CCONN IC DIP SOCKET 8POS GOLD Aries Electronics |
3,310 | - |
RFQ |
Scheda tecnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
20-0513-11HCONN SOCKET SIP 20POS GOLD Aries Electronics |
2,020 | - |
RFQ |
Scheda tecnica |
Bulk | 0513 | Active | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-0513-11CONN SOCKET SIP 24POS GOLD Aries Electronics |
2,188 | - |
RFQ |
Scheda tecnica |
Bulk | 0513 | Active | SIP | 24 (1 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
25-0513-11CONN SOCKET SIP 25POS GOLD Aries Electronics |
2,882 | - |
RFQ |
Scheda tecnica |
Bulk | 0513 | Active | SIP | 25 (1 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
37-0518-11CONN SOCKET SIP 37POS GOLD Aries Electronics |
3,846 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | SIP | 37 (1 x 37) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
09-0511-10CONN SOCKET SIP 9POS TIN Aries Electronics |
2,583 | - |
RFQ |
Scheda tecnica |
Bulk | 511 | Active | SIP | 9 (1 x 9) | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-6501-21CONN IC DIP SOCKET 8POS GOLD Aries Electronics |
2,390 | - |
RFQ |
Scheda tecnica |
Bulk | 501 | Active | DIP, 0.6 (15.24mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
40-3513-10TCONN IC DIP SOCKET 40POS GOLD Aries Electronics |
2,708 | - |
RFQ |
Scheda tecnica |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
06-6503-31CONN IC DIP SOCKET 6POS GOLD Aries Electronics |
3,409 | - |
RFQ |
Scheda tecnica |
Bulk | 503 | Active | DIP, 0.6 (15.24mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
12-3503-20CONN IC DIP SOCKET 12POS GOLD Aries Electronics |
2,921 | - |
RFQ |
Scheda tecnica |
Bulk | 503 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
12-3503-30CONN IC DIP SOCKET 12POS GOLD Aries Electronics |
2,379 | - |
RFQ |
Scheda tecnica |
Bulk | 503 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
14-3511-11CONN IC DIP SOCKET 14POS GOLD Aries Electronics |
2,723 | - |
RFQ |
Scheda tecnica |
Bulk | 511 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
14-3511-11WRCONN IC DIP SOCKET 14POS GOLD Aries Electronics |
2,484 | - |
RFQ |
Scheda tecnica |
Bulk | 511 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
38-3513-10TCONN IC DIP SOCKET 38POS GOLD Aries Electronics |
3,833 | - |
RFQ |
Scheda tecnica |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 38 (2 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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