Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
14-820-90WR

14-820-90WR

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics
3,658 -

RFQ

14-820-90WR

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
14-822-90WR

14-822-90WR

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics
3,222 -

RFQ

14-822-90WR

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
28-6556-10

28-6556-10

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
2,920 -

RFQ

28-6556-10

Scheda tecnica

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
12-6810-90WR

12-6810-90WR

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics
2,343 -

RFQ

12-6810-90WR

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
42-6513-11H

42-6513-11H

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics
2,899 -

RFQ

42-6513-11H

Scheda tecnica

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-820-90

20-820-90

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
3,746 -

RFQ

20-820-90

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
20-820-90TWR

20-820-90TWR

CONN IC DIP SOCKET 20POS TIN

Aries Electronics
2,031 -

RFQ

20-820-90TWR

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
20-822-90

20-822-90

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
2,921 -

RFQ

20-822-90

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
24-6823-90T

24-6823-90T

CONN IC DIP SOCKET 24POS TIN

Aries Electronics
2,510 -

RFQ

24-6823-90T

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
20-810-90T

20-810-90T

CONN IC DIP SOCKET 20POS TIN

Aries Electronics
3,786 -

RFQ

20-810-90T

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
22-4820-90C

22-4820-90C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
3,402 -

RFQ

22-4820-90C

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-6820-90C

22-6820-90C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
3,650 -

RFQ

22-6820-90C

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-6822-90C

22-6822-90C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
2,045 -

RFQ

22-6822-90C

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-6823-90C

22-6823-90C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
2,245 -

RFQ

22-6823-90C

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
37-PGM10012-10

37-PGM10012-10

CONN SOCKET PGA GOLD

Aries Electronics
3,289 -

RFQ

37-PGM10012-10

Scheda tecnica

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-6810-90T

16-6810-90T

CONN IC DIP SOCKET 16POS TIN

Aries Electronics
3,468 -

RFQ

16-6810-90T

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
16-6823-90

16-6823-90

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
2,417 -

RFQ

16-6823-90

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
16-2822-90C

16-2822-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
3,681 -

RFQ

16-2822-90C

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-2823-90C

16-2823-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
3,154 -

RFQ

16-2823-90C

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-4820-90C

16-4820-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
2,727 -

RFQ

16-4820-90C

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.4 (10.16mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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1500+
1500+ Media giornaliera RFQ
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20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
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