Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
126-93-324-41-002000

126-93-324-41-002000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
2,376 -

RFQ

126-93-324-41-002000

Scheda tecnica

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-424-41-002000

126-93-424-41-002000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
3,044 -

RFQ

126-93-424-41-002000

Scheda tecnica

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-624-41-002000

126-93-624-41-002000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
2,090 -

RFQ

126-93-624-41-002000

Scheda tecnica

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-324-41-002000

126-43-324-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,317 -

RFQ

126-43-324-41-002000

Scheda tecnica

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-424-41-002000

126-43-424-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,317 -

RFQ

126-43-424-41-002000

Scheda tecnica

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-624-41-002000

126-43-624-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,635 -

RFQ

126-43-624-41-002000

Scheda tecnica

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-322-41-003000

612-41-322-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,224 -

RFQ

612-41-322-41-003000

Scheda tecnica

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-428-41-007000

116-41-428-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,214 -

RFQ

116-41-428-41-007000

Scheda tecnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-628-41-007000

116-41-628-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,398 -

RFQ

116-41-628-41-007000

Scheda tecnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-328-41-007000

116-91-328-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,347 -

RFQ

116-91-328-41-007000

Scheda tecnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-428-41-007000

116-91-428-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,542 -

RFQ

116-91-428-41-007000

Scheda tecnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-628-41-007000

116-91-628-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,670 -

RFQ

116-91-628-41-007000

Scheda tecnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-322-41-001000

614-93-322-41-001000

SOCKET CARRIER LOWPRO .300 22POS

Mill-Max Manufacturing Corp.
2,724 -

RFQ

614-93-322-41-001000

Scheda tecnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-422-41-001000

614-93-422-41-001000

SOCKET CARRIER LOWPRO .400 22POS

Mill-Max Manufacturing Corp.
2,609 -

RFQ

614-93-422-41-001000

Scheda tecnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-322-41-001000

614-43-322-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,871 -

RFQ

614-43-322-41-001000

Scheda tecnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-422-41-001000

614-43-422-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,532 -

RFQ

614-43-422-41-001000

Scheda tecnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-636-41-003000

116-93-636-41-003000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.
2,044 -

RFQ

116-93-636-41-003000

Scheda tecnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-636-41-003000

116-43-636-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,625 -

RFQ

116-43-636-41-003000

Scheda tecnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-41-640-41-105000

117-41-640-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,995 -

RFQ

117-41-640-41-105000

Scheda tecnica

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-432-41-105000

110-93-432-41-105000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
3,098 -

RFQ

110-93-432-41-105000

Scheda tecnica

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 143144145146147148149150...608Next»
1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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Fudong Communication (Shenzhen) Group Co., Ltd.

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