Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
612-93-950-41-003000

612-93-950-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,657 -

RFQ

612-93-950-41-003000

Scheda tecnica

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-652-41-001000

612-93-652-41-001000

SOCKET CARRIER SLDRTL .600 52POS

Mill-Max Manufacturing Corp.
3,012 -

RFQ

612-93-652-41-001000

Scheda tecnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-652-41-001000

612-43-652-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,090 -

RFQ

612-43-652-41-001000

Scheda tecnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-306-61-001000

116-43-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,032 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-306-61-001000

116-93-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,100 -

RFQ

Tube * Active - - - - - - - - - - - - - -
126-93-652-41-001000

126-93-652-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.
2,406 -

RFQ

126-93-652-41-001000

Scheda tecnica

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-652-41-001000

126-43-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,728 -

RFQ

126-43-652-41-001000

Scheda tecnica

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-314-61-001000

115-43-314-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,421 -

RFQ

Tube * Active - - - - - - - - - - - - - -
121-13-650-41-001000

121-13-650-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.
3,924 -

RFQ

121-13-650-41-001000

Scheda tecnica

Tube 121 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-950-41-008000

116-93-950-41-008000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.
3,727 -

RFQ

116-93-950-41-008000

Scheda tecnica

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-012-05-001003

510-13-012-05-001003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,796 -

RFQ

510-13-012-05-001003

Scheda tecnica

Bulk 510 Active PGA 12 (5 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-652-41-001000

116-93-652-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.
2,594 -

RFQ

116-93-652-41-001000

Scheda tecnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-950-41-008000

116-43-950-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,178 -

RFQ

116-43-950-41-008000

Scheda tecnica

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-44-324-61-003000

115-44-324-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,009 -

RFQ

Tube * Active - - - - - - - - - - - - - -
115-44-624-61-003000

115-44-624-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,721 -

RFQ

Tube * Active - - - - - - - - - - - - - -
127-41-664-41-002000

127-41-664-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,579 -

RFQ

127-41-664-41-002000

Scheda tecnica

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-91-664-41-002000

127-91-664-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,729 -

RFQ

127-91-664-41-002000

Scheda tecnica

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-950-41-001000

126-93-950-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.
2,907 -

RFQ

126-93-950-41-001000

Scheda tecnica

Tube 126 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-950-41-001000

126-43-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,350 -

RFQ

126-43-950-41-001000

Scheda tecnica

Tube 126 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-11-650-41-001000

122-11-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,030 -

RFQ

122-11-650-41-001000

Scheda tecnica

Tube 122 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 237238239240241242243244...608Next»
1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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