Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-91-085-10-031003

510-91-085-10-031003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,657 -

RFQ

510-91-085-10-031003

Scheda tecnica

Bulk 510 Active PGA 85 (10 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-085-13-042002

510-91-085-13-042002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,690 -

RFQ

510-91-085-13-042002

Scheda tecnica

Bulk 510 Active PGA 85 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-085-13-042003

510-91-085-13-042003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,478 -

RFQ

510-91-085-13-042003

Scheda tecnica

Bulk 510 Active PGA 85 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-085-13-081002

510-91-085-13-081002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,323 -

RFQ

510-91-085-13-081002

Scheda tecnica

Bulk 510 Active PGA 85 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-085-13-081003

510-91-085-13-081003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,178 -

RFQ

510-91-085-13-081003

Scheda tecnica

Bulk 510 Active PGA 85 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-13-964-41-001000

121-13-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.
3,921 -

RFQ

121-13-964-41-001000

Scheda tecnica

Tube 121 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-328-61-001000

116-43-328-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,071 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-43-428-61-001000

116-43-428-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,593 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-43-628-61-001000

116-43-628-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,753 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-328-61-001000

116-93-328-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,983 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-428-61-001000

116-93-428-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,658 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-628-61-001000

116-93-628-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,342 -

RFQ

Tube * Active - - - - - - - - - - - - - -
48-6508-20

48-6508-20

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics
3,734 -

RFQ

48-6508-20

Scheda tecnica

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
48-6508-30

48-6508-30

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics
3,647 -

RFQ

48-6508-30

Scheda tecnica

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
34-0508-21

34-0508-21

CONN SOCKET SIP 34POS GOLD

Aries Electronics
3,030 -

RFQ

34-0508-21

Scheda tecnica

Bulk 508 Active SIP 34 (1 x 34) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
34-0508-31

34-0508-31

CONN SOCKET SIP 34POS GOLD

Aries Electronics
2,210 -

RFQ

34-0508-31

Scheda tecnica

Bulk 508 Active SIP 34 (1 x 34) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
518-77-192M16-001105

518-77-192M16-001105

CONN SOCKET PGA 192POS GOLD

Preci-Dip
3,958 -

RFQ

518-77-192M16-001105

Scheda tecnica

Bulk 518 Active PGA 192 (16 x 16) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
34-1508-21

34-1508-21

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics
3,163 -

RFQ

34-1508-21

Scheda tecnica

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
34-1508-31

34-1508-31

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics
3,939 -

RFQ

34-1508-31

Scheda tecnica

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
110-13-648-61-001000

110-13-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,209 -

RFQ

Tube * Active - - - - - - - - - - - - - -
Total 21991 Record«Prev1... 619620621622623624625626...1100Next»
1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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