Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-13-135-14-051003

510-13-135-14-051003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,040 -

RFQ

510-13-135-14-051003

Scheda tecnica

Bulk 510 Active PGA 135 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-136-14-051001

510-13-136-14-051001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,680 -

RFQ

510-13-136-14-051001

Scheda tecnica

Bulk 510 Active PGA 136 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-136-14-051002

510-13-136-14-051002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,279 -

RFQ

510-13-136-14-051002

Scheda tecnica

Bulk 510 Active PGA 136 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-136-14-051003

510-13-136-14-051003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,357 -

RFQ

510-13-136-14-051003

Scheda tecnica

Bulk 510 Active PGA 136 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-500M30-001166

550-10-500M30-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
2,945 -

RFQ

550-10-500M30-001166

Scheda tecnica

Bulk 550 Active BGA 500 (30 x 30) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
514-83-352M26-001148

514-83-352M26-001148

CONN SOCKET BGA 352POS GOLD

Preci-Dip
2,656 -

RFQ

514-83-352M26-001148

Scheda tecnica

Bulk 514 Active BGA 352 (26 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-83-685-19-000111

517-83-685-19-000111

CONN SOCKET PGA 685POS GOLD

Preci-Dip
2,445 -

RFQ

517-83-685-19-000111

Scheda tecnica

Bulk 517 Active PGA 685 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-325-18-111144

614-87-325-18-111144

CONN SOCKET PGA 325POS GOLD

Preci-Dip
2,257 -

RFQ

614-87-325-18-111144

Scheda tecnica

Bulk 614 Active PGA 325 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
101-PGM13022-10H

101-PGM13022-10H

CONN SOCKET PGA GOLD

Aries Electronics
3,951 -

RFQ

101-PGM13022-10H

Scheda tecnica

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
550-10-504M29-001166

550-10-504M29-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
2,983 -

RFQ

550-10-504M29-001166

Scheda tecnica

Bulk 550 Active BGA 504 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
510-93-256-16-000002

510-93-256-16-000002

SOCKET SOLDERTAIL 256-PGA

Mill-Max Manufacturing Corp.
3,063 -

RFQ

Bulk 510 Active PGA 256 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-256-19-081002

510-93-256-19-081002

SOCKET SOLDERTAIL 256-PGA

Mill-Max Manufacturing Corp.
2,363 -

RFQ

Bulk 510 Active PGA 256 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-256-16-000001

510-93-256-16-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,629 -

RFQ

510-93-256-16-000001

Scheda tecnica

Bulk 510 Active PGA 256 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-256-16-000003

510-93-256-16-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,056 -

RFQ

510-93-256-16-000003

Scheda tecnica

Bulk 510 Active PGA 256 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-256-19-081001

510-93-256-19-081001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,394 -

RFQ

510-93-256-19-081001

Scheda tecnica

Bulk 510 Active PGA 256 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-256-19-081003

510-93-256-19-081003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,801 -

RFQ

510-93-256-19-081003

Scheda tecnica

Bulk 510 Active PGA 256 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
160-PGM14029-40

160-PGM14029-40

CONN SOCKET PGA GOLD

Aries Electronics
3,823 -

RFQ

160-PGM14029-40

Scheda tecnica

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
550-10-352M26-001152

550-10-352M26-001152

BGA SOLDER TAIL

Preci-Dip
3,710 -

RFQ

550-10-352M26-001152

Scheda tecnica

Bulk 550 Active BGA 352 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
546-83-391-18-101147

546-83-391-18-101147

CONN SOCKET PGA 391POS GOLD

Preci-Dip
3,084 -

RFQ

546-83-391-18-101147

Scheda tecnica

Bulk 546 Active PGA 391 (18 x 18) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-43-240-17-061002

510-43-240-17-061002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,291 -

RFQ

510-43-240-17-061002

Scheda tecnica

Bulk 510 Active PGA 240 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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