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| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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614-87-210-31-012101CONN IC DIP SOCKET 10POS GOLD Preci-Dip |
2,742 | - |
RFQ |
Scheda tecnica |
Bulk | 614 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-87-314-10-002101CONN IC DIP SOCKET 14POS GOLD Preci-Dip |
3,567 | - |
RFQ |
Scheda tecnica |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7), 8 Loaded | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-87-318-41-005101CONN IC DIP SOCKET 18POS GOLD Preci-Dip |
3,608 | - |
RFQ |
Scheda tecnica |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-87-318-41-605101CONN IC DIP SOCKET 18POS GOLD Preci-Dip |
3,341 | - |
RFQ |
Scheda tecnica |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-304-41-004101CONN IC DIP SOCKET 4POS GOLD Preci-Dip |
3,880 | - |
RFQ |
Scheda tecnica |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
04-0518-10TCONN SOCKET SIP 4POS GOLD Aries Electronics |
3,376 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | SIP | 4 (1 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
04-1518-10TCONN IC DIP SOCKET 4POS GOLD Aries Electronics |
3,239 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
01-0508-20CONN SOCKET SIP 1POS GOLD Aries Electronics |
2,070 | - |
RFQ |
Scheda tecnica |
Bulk | 508 | Active | SIP | 1 (1 x 1) | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
01-0508-30CONN SOCKET SIP 1POS GOLD Aries Electronics |
2,632 | - |
RFQ |
Scheda tecnica |
Bulk | 508 | Active | SIP | 1 (1 x 1) | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
116-83-306-41-007101CONN IC DIP SOCKET 6POS GOLD Preci-Dip |
2,950 | - |
RFQ |
Scheda tecnica |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-87-322-41-001101CONN IC DIP SOCKET 22POS GOLD Preci-Dip |
2,853 | - |
RFQ |
Scheda tecnica |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-83-314-10-001101CONN IC DIP SOCKET 14POS GOLD Preci-Dip |
3,418 | - |
RFQ |
Scheda tecnica |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
110-87-322-41-001151CONN IC DIP SOCKET 22POS GOLD Preci-Dip |
2,528 | - |
RFQ |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, No Center Bar | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
116-87-610-41-018101CONN IC DIP SOCKET 10POS GOLD Preci-Dip |
2,386 | - |
RFQ |
Scheda tecnica |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
540-88-032-17-400CONN SOCKET PLCC 32POS TIN Preci-Dip |
2,345 | - |
RFQ |
Scheda tecnica |
Bulk | 540 | Active | PLCC | 32 (4 x 8) | 0.050 (1.27mm) | Tin | - | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polyphenylene Sulfide (PPS) |
|
116-87-308-41-007101CONN IC DIP SOCKET 8POS GOLD Preci-Dip |
2,567 | - |
RFQ |
Scheda tecnica |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-87-310-31-012101CONN IC DIP SOCKET 10POS GOLD Preci-Dip |
3,803 | - |
RFQ |
Scheda tecnica |
Bulk | 614 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-87-610-31-012101CONN IC DIP SOCKET 10POS GOLD Preci-Dip |
3,312 | - |
RFQ |
Scheda tecnica |
Bulk | 614 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-308-41-006101CONN IC DIP SOCKET 8POS GOLD Preci-Dip |
3,152 | - |
RFQ |
Scheda tecnica |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
115-87-316-41-001101CONN IC DIP SOCKET 16POS GOLD Preci-Dip |
3,825 | - |
RFQ |
Bulk | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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