+86 075582561136
Carica BOM
Zoccoli per IC, transistor
| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
643646-8CONN SOCKET SIP 14POS TIN TE Connectivity AMP Connectors |
2,789 | - |
RFQ |
Scheda tecnica |
Tray | Diplomate DL | Active | SIP | 14 (1 x 14) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
643647-1CONN SOCKET SIP 15POS TIN TE Connectivity AMP Connectors |
3,064 | - |
RFQ |
Scheda tecnica |
Tray | Diplomate DL | Obsolete | SIP | 15 (1 x 15) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
643650-1CONN SOCKET SIP 18POS TIN TE Connectivity AMP Connectors |
2,954 | - |
RFQ |
Scheda tecnica |
Tray | Diplomate DL | Obsolete | SIP | 18 (1 x 18) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
643652-1CONN SOCKET SIP 20POS TIN TE Connectivity AMP Connectors |
3,579 | - |
RFQ |
Scheda tecnica |
Tray | Diplomate DL | Obsolete | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
643652-3CONN SOCKET SIP 20POS TIN TE Connectivity AMP Connectors |
3,033 | - |
RFQ |
Scheda tecnica |
Tray | Diplomate DL | Obsolete | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
643652-6CONN SOCKET SIP 20POS TIN TE Connectivity AMP Connectors |
2,429 | - |
RFQ |
Scheda tecnica |
Tray | Diplomate DL | Obsolete | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
643657-1CONN SOCKET SIP 25POS TIN TE Connectivity AMP Connectors |
3,046 | - |
RFQ |
Scheda tecnica |
Tray,Box | Diplomate DL | Obsolete | SIP | 25 (1 x 25) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
523-13-289-17-000003CONN PGA SOCKET 289 PIN 17X17 Mill-Max Manufacturing Corp. |
3,943 | - |
RFQ |
Scheda tecnica |
Bulk | 523 | Active | PGA | 289 (17 x 17) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
523-13-120-13-061001CONN PGA SOCKET 120 PIN 13X13 Mill-Max Manufacturing Corp. |
2,576 | - |
RFQ |
Scheda tecnica |
Bulk | 523 | Active | PGA | 120 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
643640-1CONN SOCKET SIP 8POS TIN TE Connectivity AMP Connectors |
3,051 | - |
RFQ |
Scheda tecnica |
Tray | Diplomate DL | Obsolete | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
643642-1CONN SOCKET SIP 10POS TIN TE Connectivity AMP Connectors |
3,527 | - |
RFQ |
Scheda tecnica |
Tray | Diplomate DL | Obsolete | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
821949-5CONN SOCKET PQFP 132POS TIN-LEAD TE Connectivity AMP Connectors |
2,482 | - |
RFQ |
Scheda tecnica |
Tube | - | Obsolete | QFP | 132 (4 x 33) | 0.050 (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) |
|
821949-4CONN SOCKET PQFP 100POS TIN-LEAD TE Connectivity AMP Connectors |
3,831 | - |
RFQ |
Scheda tecnica |
Tube,Tube | - | Obsolete | QFP | 100 (4 x 25) | 0.050 (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) |
|
822114-4CONN SOCKET PQFP 160POS TIN-LEAD TE Connectivity AMP Connectors |
3,707 | - |
RFQ |
Scheda tecnica |
Tube | - | Obsolete | QFP | 160 (4 x 40) | 0.050 (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) |
|
2-382189-1CONN IC DIP SOCKET 32POS TIN TE Connectivity AMP Connectors |
3,042 | - |
RFQ |
Scheda tecnica |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic |
|
|
2-644018-2CONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors |
2,089 | - |
RFQ |
Scheda tecnica |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic |
|
2-641932-4CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
3,319 | - |
RFQ |
Scheda tecnica |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic |
|
2-641933-1CONN IC DIP SOCKET 24POS TIN TE Connectivity AMP Connectors |
2,329 | - |
RFQ |
Scheda tecnica |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic |
|
|
2-644018-4CONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors |
3,685 | - |
RFQ |
Scheda tecnica |
Tube,Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic |
|
2-641932-2CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
3,442 | - |
RFQ |
Scheda tecnica |
Tube,Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic |
- 1500+ Media giornaliera RFQ
- 20,000.000 Unità prodotto standard
- 1800+ Produttori mondiali
- 15,000+ Magazzino in stock
