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| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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54-PRS17038-16CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,396 | - |
RFQ |
Scheda tecnica |
Bulk | PRS | Obsolete | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Bronze | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
68-PLS11033-16CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,503 | - |
RFQ |
Scheda tecnica |
Bulk | PLS | Obsolete | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Bronze | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
68-PRS11033-16CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,327 | - |
RFQ |
Scheda tecnica |
Bulk | PRS | Obsolete | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Bronze | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
80-PRL13127-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,126 | - |
RFQ |
Scheda tecnica |
Bulk | PRL | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
80-PRL15072-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,648 | - |
RFQ |
Scheda tecnica |
Bulk | PRL | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
84-PRS11010-16CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,863 | - |
RFQ |
Scheda tecnica |
Bulk | PRS | Obsolete | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Bronze | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
84-PRS11032-16CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,372 | - |
RFQ |
Scheda tecnica |
Bulk | PRS | Obsolete | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Bronze | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
34-6511-10CONN IC DIP SOCKET 34POS TIN Aries Electronics |
3,268 | - |
RFQ |
Scheda tecnica |
Bulk | 511 | Active | DIP, 0.6 (15.24mm) Row Spacing | 34 (2 x 17) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
34-6511-11CONN IC DIP SOCKET 34POS GOLD Aries Electronics |
3,227 | - |
RFQ |
Scheda tecnica |
Bulk | 511 | Active | DIP, 0.6 (15.24mm) Row Spacing | 34 (2 x 17) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
22-4511-10CONN IC DIP SOCKET 22POS TIN Aries Electronics |
2,328 | - |
RFQ |
Scheda tecnica |
Bulk | 511 | Obsolete | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
22-4511-11CONN IC DIP SOCKET 22POS GOLD Aries Electronics |
3,962 | - |
RFQ |
Scheda tecnica |
Bulk | 511 | Obsolete | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
1109822501 DIP TEST SCKT SOLDER TAIL Aries Electronics |
2,825 | - |
RFQ |
Scheda tecnica |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
14-3501-40CONN IC DIP SOCKET 14POS TIN Aries Electronics |
2,241 | - |
RFQ |
Scheda tecnica |
Bulk | 501 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
22-4501-20CONN IC DIP SOCKET 22POS TIN Aries Electronics |
2,727 | - |
RFQ |
Scheda tecnica |
Bulk | 501 | Obsolete | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
22-4501-21CONN IC DIP SOCKET 22POS GOLD Aries Electronics |
2,912 | - |
RFQ |
Scheda tecnica |
Bulk | 501 | Obsolete | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
22-4501-30CONN IC DIP SOCKET 22POS TIN Aries Electronics |
2,380 | - |
RFQ |
Scheda tecnica |
Bulk | 501 | Obsolete | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
22-4501-31CONN IC DIP SOCKET 22POS GOLD Aries Electronics |
3,163 | - |
RFQ |
Scheda tecnica |
Bulk | 501 | Obsolete | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
4778-115-12501 DIP TEST SCKT SOLDER TAIL Aries Electronics |
2,675 | - |
RFQ |
Scheda tecnica |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
11075570511 STRIP-LINE SCKT W/SOLDER TL Aries Electronics |
3,886 | - |
RFQ |
Scheda tecnica |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
0500-0.3000511 STRIP-LINE SCKT W/SOLDER TL Aries Electronics |
3,405 | - |
RFQ |
Scheda tecnica |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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