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| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2201838-1CONN SOCKET LGA 2011POS GOLD TE Connectivity AMP Connectors |
269 | - |
RFQ |
Scheda tecnica |
Bulk | - | Last Time Buy | LGA | 2011 (47 x 58) | 0.040 (1.02mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.035 (0.90mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
1-2324271-2LEFT SEGMEN LGA4189-4 SOCKET-P4 TE Connectivity AMP Connectors |
2,972 | - |
RFQ |
Scheda tecnica |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
|
1-2324271-1RIGHT SEGMEN LGA4189-4 SOCKET-P4 TE Connectivity AMP Connectors |
114 | - |
RFQ |
Scheda tecnica |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
3-1571550-0CONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors |
704 | - |
RFQ |
Scheda tecnica |
Tube | 500 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
2319757-1DUAL LGA,257 POS, DMD SOCKET TE Connectivity AMP Connectors |
913 | - |
RFQ |
Scheda tecnica |
Tray | DMD | Active | LGA | 257 (20 x 30) | 0.039 (1.00mm) | Gold | 3.00µin (0.076µm) | Copper Alloy | Surface Mount | Board Guide, Open Frame | Solder | - | - | - | - | Thermoplastic |
|
8080-1G1-LFCONN TRANSIST TO-3 3POS TIN TE Connectivity AMP Connectors |
379 | - |
RFQ |
Scheda tecnica |
Bulk | 8080 | Active | Transistor, TO-3 | 3 (Oval) | - | Tin | 200.0µin (5.08µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
|
|
1-2324271-6LEFT SEGMEN LGA4189-5 SOCKET-P5 TE Connectivity AMP Connectors |
165 | - |
RFQ |
Scheda tecnica |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
|
1-2324271-5RIGHT SEGMEN LGA4189-5 SOCKET-P5 TE Connectivity AMP Connectors |
163 | - |
RFQ |
Scheda tecnica |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
2-2129710-7CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors |
154 | - |
RFQ |
Scheda tecnica |
Tray | - | Active | LGA | 3647 | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Thermoplastic |
|
4-1571552-2CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
1,704 | - |
RFQ |
Scheda tecnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
808-AG11D-LFCONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
2,657 | - |
RFQ |
Scheda tecnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
2-1571551-2CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
4,214 | - |
RFQ |
Scheda tecnica |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
520-AG11D-ESDIP SOCKET T/H 20POS TE Connectivity AMP Connectors |
867 | - |
RFQ |
Scheda tecnica |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
4-1571552-6CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors |
1,786 | - |
RFQ |
Scheda tecnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
1-1571552-2CONN IC DIP SOCKET 40POS TIN TE Connectivity AMP Connectors |
142 | - |
RFQ |
Scheda tecnica |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
816-AG11DCONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
960 | - |
RFQ |
Scheda tecnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
516-AG12D-LFCONN IC DIP SOCKET 16POS TIN TE Connectivity AMP Connectors |
1,173 | - |
RFQ |
Scheda tecnica |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
822-AG11DCONN IC DIP SOCKET 22POS GOLD TE Connectivity AMP Connectors |
1,669 | - |
RFQ |
Scheda tecnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester |
|
818-AG11DCONN IC DIP SOCKET 18POS GOLD TE Connectivity AMP Connectors |
432 | - |
RFQ |
Scheda tecnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
1-1571994-0CONN SOCKET SIP 10POS GOLD TE Connectivity AMP Connectors |
118 | - |
RFQ |
Scheda tecnica |
Tube | 510 | Obsolete | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 20.0µin (0.51µm) | Copper | Thermoplastic, Polyester |
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