Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
5-1437504-7

5-1437504-7

CONN TRANSIST TO-3 3POS GOLD

TE Connectivity AMP Connectors
3,640 -

RFQ

Bulk 8060 Active Transistor, TO-3 3 (Oval) - Gold - Beryllium Copper Chassis Mount Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE)
5-1437530-3

5-1437530-3

CONN SOCKET SIP 9POS GOLD

TE Connectivity AMP Connectors
2,439 -

RFQ

5-1437530-3

Scheda tecnica

Bulk 500 Obsolete SIP 9 (1 x 9) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold - Beryllium Copper Thermoplastic
5-1437530-6

5-1437530-6

CONN SOCKET SIP 12POS GOLD

TE Connectivity AMP Connectors
3,276 -

RFQ

5-1437530-6

Scheda tecnica

Bulk 500 Obsolete SIP 12 (1 x 12) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold - Beryllium Copper Thermoplastic
5-1437537-4

5-1437537-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
3,060 -

RFQ

5-1437537-4

Scheda tecnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
864-AG11D-ESL

864-AG11D-ESL

CONN IC DIP SOCKET 64POS GOLD

TE Connectivity AMP Connectors
3,476 -

RFQ

864-AG11D-ESL

Scheda tecnica

Tube 800 Obsolete DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold Flash Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
643642-8

643642-8

CONN SOCKET SIP 10POS TIN

TE Connectivity AMP Connectors
2,197 -

RFQ

643642-8

Scheda tecnica

Tray,Box Diplomate DL Obsolete SIP 10 (1 x 10) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
643643-6

643643-6

CONN SOCKET SIP 11POS TIN

TE Connectivity AMP Connectors
2,556 -

RFQ

643643-6

Scheda tecnica

Tray Diplomate DL Obsolete SIP 11 (1 x 11) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
643655-8

643655-8

CONN SOCKET SIP 23POS TIN

TE Connectivity AMP Connectors
2,192 -

RFQ

643655-8

Scheda tecnica

Tray Diplomate DL Obsolete SIP 23 (1 x 23) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
7-1437536-2

7-1437536-2

CONN IC DIP SOCKET 36POS GOLD

TE Connectivity AMP Connectors
3,289 -

RFQ

7-1437536-2

Scheda tecnica

Tube 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass -
7-1437537-6

7-1437537-6

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors
3,871 -

RFQ

7-1437537-6

Scheda tecnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
2-1437539-2

2-1437539-2

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors
3,486 -

RFQ

2-1437539-2

Scheda tecnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
1-1825109-1

1-1825109-1

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
3,818 -

RFQ

1-1825109-1

Scheda tecnica

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
1-1825376-2

1-1825376-2

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors
2,633 -

RFQ

1-1825376-2

Scheda tecnica

Tube,Tray Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
1825094-4

1825094-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
3,710 -

RFQ

1825094-4

Scheda tecnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825108-1

1825108-1

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
2,650 -

RFQ

1825108-1

Scheda tecnica

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825109-3

1825109-3

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors
2,120 -

RFQ

1825109-3

Scheda tecnica

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825276-2

1825276-2

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors
2,652 -

RFQ

1825276-2

Scheda tecnica

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825376-2

1825376-2

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors
2,901 -

RFQ

1825376-2

Scheda tecnica

Tube,Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
2-821949-4

2-821949-4

CONN SOCKET PQFP 100POS TIN-LEAD

TE Connectivity AMP Connectors
2,548 -

RFQ

2-821949-4

Scheda tecnica

Tube - Obsolete QFP 100 (4 x 25) 0.050 (1.27mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050 (1.27mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Liquid Crystal Polymer (LCP)
1-1747890-1

1-1747890-1

CONN SOCKET LGA 771POS GOLD

TE Connectivity AMP Connectors
3,291 -

RFQ

1-1747890-1

Scheda tecnica

Tray - Obsolete LGA 771 (33 x 33) 0.043 (1.09mm) Gold - Copper Alloy Surface Mount Open Frame Solder 0.043 (1.09mm) - - - Thermoplastic
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1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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