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| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
397952HMP 366 3% .022DIA. 23AWG Multicore |
3,675 | - |
RFQ |
Scheda tecnica |
Bulk | 366 | Active | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 0.022 (0.56mm) | 565 ~ 574°F (296 ~ 301°C) | Rosin Activated (RA) | 23 AWG, 24 SWG | - | Leaded | Spool, 8.8 oz (250g) | - | - |
|
38682063/37 HYDRO-X 2% .022DIA 23AWG Multicore |
2,528 | - |
RFQ |
Scheda tecnica |
Bulk | Hydro-X | Active | Wire Solder | Sn63Pb37 (63/37) | 0.022 (0.56mm) | 361°F (183°C) | Water Soluble | 23 AWG, 24 SWG | - | Leaded | Spool, 8.8 oz (250g) | - | - |
|
38684463/37 400 2% .015DIA 27AWG Multicore |
3,542 | - |
RFQ |
Scheda tecnica |
Bulk | C400 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.015 (0.38mm) | 361°F (183°C) | No-Clean | 27 AWG, 28 SWG | - | Leaded | Spool, 8.8 oz (250g) | - | - |
|
39545163/37 CRYSL 502 3% .032DIA 20AWG Multicore |
3,991 | - |
RFQ |
Scheda tecnica |
Bulk | C502 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032 (0.81mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
39546760/40 370 5C 1.22MM 0.5KG AM Multicore |
2,644 | - |
RFQ |
Scheda tecnica |
Bulk | 370 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.048 (1.22mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 16 AWG, 18 SWG | - | Leaded | Spool, 17.64 oz (500g) | - | - |
|
38685163/37 CRYSL 502 2% .022DIA 23AWG Multicore |
3,731 | - |
RFQ |
Scheda tecnica |
Bulk | C502 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.022 (0.56mm) | 361°F (183°C) | No-Clean | 23 AWG, 24 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
38681863/37 HYDRO-X 2% .032DIA 20AWG Multicore |
3,321 | - |
RFQ |
Scheda tecnica |
Bulk | Hydro-X | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032 (0.81mm) | 361°F (183°C) | Water Soluble | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
38692763/37 400 2% .032DIA 20AWG Multicore |
3,412 | - |
RFQ |
Bulk | C400 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032 (0.81mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | |
|
39224963/37 400 2% .064DIA 14AWG Multicore |
3,098 | - |
RFQ |
Scheda tecnica |
Bulk | C400 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.064 (1.63mm) | 361°F (183°C) | No-Clean | 14 AWG, 16 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
67382897SC 400 2% .022DIA 23AWG Multicore |
3,254 | - |
RFQ |
Scheda tecnica |
Bulk | C400 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.022 (0.56mm) | 423°F (217°C) | No-Clean | 23 AWG, 24 SWG | - | Lead Free | Spool, 8.8 oz (250g) | - | - |
|
38687663/37 400 2% .024DIA 22AWG Multicore |
2,977 | - |
RFQ |
Scheda tecnica |
Bulk | C400 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.024 (0.61mm) | 361°F (183°C) | No-Clean | 22 AWG, 23 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
79603797SC C511 2% .015DIA 27AWG Multicore |
3,123 | - |
RFQ |
Scheda tecnica |
Bulk | C511™ | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015 (0.38mm) | 423°F (217°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | - | Lead Free | Spool, 8.8 oz (250g) | - | - |
|
45031463/37 400 2% .022DIA 23AWG Multicore |
2,048 | - |
RFQ |
Scheda tecnica |
Bulk | C400 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.022 (0.56mm) | 361°F (183°C) | No-Clean | 23 AWG, 24 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
79606597SC 400 2% 0.38 DIA Multicore |
2,939 | - |
RFQ |
Scheda tecnica |
Bulk | C400 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015 (0.38mm) | 423°F (217°C) | No-Clean | 27 AWG, 28 SWG | - | Lead Free | Spool, 8.8 oz (250g) | - | - |
|
|
86594099C C511 3C 0.81MM 0.5KG AM Multicore |
2,722 | - |
RFQ |
Scheda tecnica |
Bulk | C511™ | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.032 (0.81mm) | 440 ~ 464°F (227 ~ 240°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
73299897SC C511 2% .064DIA 14AWG Multicore |
2,850 | - |
RFQ |
Scheda tecnica |
Bulk | C511™ | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.064 (1.63mm) | 423°F (217°C) | No-Clean | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
|
84887497SC C502 3C 0.81MM 0.5KG AM Multicore |
3,325 | - |
RFQ |
Scheda tecnica |
Bulk | C502 | Active | Wire Solder | - | 0.032 (0.81mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | - | - | Spool, 1 lb (454 g) | - | - |
|
67383197SC 400 2% .048DIA 16AWG Multicore |
2,075 | - |
RFQ |
Scheda tecnica |
Bulk | C400 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.048 (1.22mm) | 423°F (217°C) | No-Clean | 16 AWG, 18 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
|
55001463/37 WS200 SOLDER PASTE 75GM Multicore |
3,002 | - |
RFQ |
Scheda tecnica |
Syringe | WS200™ | Obsolete | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | - | Leaded | Syringe, 2.65 oz (75g) | 6 Months | Date of Manufacture |
|
38683963/37 370 3% .032DIA 20AWG Multicore |
2,602 | - |
RFQ |
Scheda tecnica |
Spool | 370 | Obsolete | Wire Solder | Sn63Pb37 (63/37) | 0.032 (0.81mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | - | Leaded | Spool, 17.64 oz (500g) | - | - |
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