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Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus TipType TipShape Height Width Length Diameter TipChipSize TemperatureRange
LT428

LT428

SMD HOT AIR NOZZLE, HOLE DIA: 1.

EDSYN INCORPORATED
2,573 -

RFQ

Bag LONER® Active Rework (Hot Air), SMD Nozzle - - 0.252 (6.40mm) 0.059 (1.50mm) - -
TSX713

TSX713

REFLOW VACUUM TIP, HOLE DIA: 1.3

EDSYN INCORPORATED
2,448 -

RFQ

Bag SOLDAVAC® Active Rework Nozzle - - 0.551 (14.00mm) 0.051 (1.30mm) - -
CT110

CT110

CROWN TUNNEL SMD TIP (9.5X10.2MM

EDSYN INCORPORATED
2,575 -

RFQ

Bag - Active Soldering Tunnel - 0.374 (9.50mm) 0.402 (10.20mm) - SOIC-18 -
CT510

CT510

CROWN TUNNEL SMD TIP (5.1X10.4 M

EDSYN INCORPORATED
3,532 -

RFQ

Bag - Active Soldering Tunnel - 0.201 (5.10mm) 0.409 (10.40mm) - SOIC-14, 16 -
Total 24 Record«Prev12Next»
1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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