Termico - Dissipatori di calore

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
114991948

114991948

ICE TOWER CPU COOLING FAN FOR RA

Seeed Technology Co., Ltd
3,504 -

RFQ

114991948

Scheda tecnica

Bulk ICE Tower Obsolete Board Level Bolt On and Thermal Tape, Adhesive (Included) Rectangular - - - - - - - -
114991989

114991989

HEATSINK FOR ROCK PI 4

Seeed Technology Co., Ltd
3,498 -

RFQ

114991989

Scheda tecnica

Bulk - Obsolete Top Mount Kit Bolt On, Thermal Material Rectangular - - - - - - - -
110070016

110070016

RPI HEAT SINK KIT COPPER/ALUM

Seeed Technology Co., Ltd
2,978 -

RFQ

110070016

Scheda tecnica

Bulk - Obsolete Heat Spreader Kit, Top Mount - Square - - - - - - - Aluminum, Copper
EN104037

EN104037

ACC HEATSINK MA-MA3

Enclustra FPGA Solutions
2,395 -

RFQ

Box Mars MA3 Obsolete - - - - - - - - - - -
Total 113324 Record«Prev1... 56635664566556665667Next»
1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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