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| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
D01-9973242CONN SOCKET SIP 32POS GOLD Harwin Inc. |
14,048 | - |
RFQ |
Scheda tecnica |
Tube | D01-997 | Active | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D01-9953242CONN SOCKET SIP 32POS GOLD Harwin Inc. |
3,183 | - |
RFQ |
Scheda tecnica |
Bulk | D01-995 | Active | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D01-9972042CONN SOCKET SIP 20POS GOLD Harwin Inc. |
5,816 | - |
RFQ |
Scheda tecnica |
Tube | D01-997 | Active | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D2899-42CONN IC DIP SOCKET 3POS GOLD Harwin Inc. |
1,566 | - |
RFQ |
Scheda tecnica |
Bulk | D2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 3 (1 x 3), 2 Loaded | 0.200 (5.08mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.200 (5.08mm) | Tin | 196.9µin (5.00µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
D2840-42CONN IC DIP SOCKET 40POS GOLD Harwin Inc. |
255 | - |
RFQ |
Scheda tecnica |
Tube | D2 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic |
|
D01-9952042CONN SOCKET SIP 20POS GOLD Harwin Inc. |
364 | - |
RFQ |
Scheda tecnica |
Bulk | D01-995 | Active | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D2822-42CONN IC DIP SOCKET 22POS GOLD Harwin Inc. |
1,083 | - |
RFQ |
Scheda tecnica |
Tube | D2 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic |
|
D2824-42CONN IC DIP SOCKET 24POS GOLD Harwin Inc. |
2,780 | - |
RFQ |
Scheda tecnica |
Tube | D2 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic |
|
D2928-42CONN IC DIP SOCKET 28POS GOLD Harwin Inc. |
165 | - |
RFQ |
Scheda tecnica |
Tube | D2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic |
|
D2832-42CONN IC DIP SOCKET 32POS GOLD Harwin Inc. |
405 | - |
RFQ |
Scheda tecnica |
Tube | D2 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic |
|
D2818-42CONN IC DIP SOCKET 18POS GOLD Harwin Inc. |
2,060 | - |
RFQ |
Scheda tecnica |
Tube | D2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic |
|
D01-9970442CONN SOCKET SIP 4POS GOLD Harwin Inc. |
3,370 | - |
RFQ |
Scheda tecnica |
Tube | D01-997 | Active | SIP | 4 (1 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D01-9970542CONN SOCKET SIP 5POS GOLD Harwin Inc. |
2,498 | - |
RFQ |
Scheda tecnica |
Tube | D01-997 | Active | SIP | 5 (1 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D01-9970742CONN SOCKET SIP 7POS GOLD Harwin Inc. |
4,797 | - |
RFQ |
Scheda tecnica |
Tube | D01-997 | Active | SIP | 7 (1 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D01-9971242CONN SOCKET SIP 12POS GOLD Harwin Inc. |
4,700 | - |
RFQ |
Scheda tecnica |
Tube | D01-997 | Active | SIP | 12 (1 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D8864-42CONN IC DIP SOCKET 64POS GOLD Harwin Inc. |
432 | - |
RFQ |
Scheda tecnica |
Tube | D8864 | Active | DIP, 0.75 (19.05mm) Row Spacing | 64 (2 x 32) | 0.070 (1.78mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D0808-42CONN IC DIP SOCKET 8POS GOLD Harwin Inc. |
159 | - |
RFQ |
Scheda tecnica |
Bulk | D0 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D2924-42CONN IC DIP SOCKET 24POS GOLD Harwin Inc. |
2,150 | - |
RFQ |
Scheda tecnica |
Tube | D2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic |
|
D0816-42CONN IC DIP SOCKET 16POS GOLD Harwin Inc. |
2,725 | - |
RFQ |
Scheda tecnica |
Bulk | D0 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D01-9970642CONN SOCKET SIP 6POS GOLD Harwin Inc. |
3,681 | - |
RFQ |
Scheda tecnica |
Tube | D01-997 | Active | SIP | 6 (1 x 6) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
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