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Oscillatori
| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Package/Case | Packaging | Series | ProductStatus | BaseResonator | Type | Frequency | Function | Output | Voltage-Supply | FrequencyStability | AbsolutePullRange(APR) | OperatingTemperature | SpreadSpectrumBandwidth | Current-Supply(Max) | Ratings | MountingType | Size/Dimension |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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DSC1102AI2-106.0000MEMS OSC LOW JITTER 106MHZ LVPEC Microchip Technology |
3,656 | - |
RFQ |
Scheda tecnica |
6-VDFN Exposed Pad | Tube | DSC1102 | Active | MEMS | XO (Standard) | 106 MHz | Standby (Power Down) | LVPECL | 2.25V ~ 3.6V | ±25ppm | - | -40°C ~ 85°C | - | 58mA | - | Surface Mount | 0.276 L x 0.197 W (7.00mm x 5.00mm) |
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DSC1102AI2-106.0000TMEMS OSC LOW JITTER 106MHZ LVPEC Microchip Technology |
3,217 | - |
RFQ |
Scheda tecnica |
6-VDFN Exposed Pad | Tape & Reel (TR) | DSC1102 | Active | MEMS | XO (Standard) | 106 MHz | Standby (Power Down) | LVPECL | 2.25V ~ 3.6V | ±25ppm | - | -40°C ~ 85°C | - | 58mA | - | Surface Mount | 0.276 L x 0.197 W (7.00mm x 5.00mm) |
|
|
DSC1102AI5-160.0000MEMS OSC LOW JITTER 160MHZ LVPEC Microchip Technology |
3,117 | - |
RFQ |
Scheda tecnica |
6-VDFN Exposed Pad | Tube | DSC1102 | Active | MEMS | XO (Standard) | 160 MHz | Standby (Power Down) | LVPECL | 2.25V ~ 3.6V | ±10ppm | - | -40°C ~ 85°C | - | 58mA | - | Surface Mount | 0.276 L x 0.197 W (7.00mm x 5.00mm) |
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DSC1102AI5-160.0000TMEMS OSC LOW JITTER 160MHZ LVPEC Microchip Technology |
3,935 | - |
RFQ |
Scheda tecnica |
6-VDFN Exposed Pad | Tape & Reel (TR) | DSC1102 | Active | MEMS | XO (Standard) | 160 MHz | Standby (Power Down) | LVPECL | 2.25V ~ 3.6V | ±10ppm | - | -40°C ~ 85°C | - | 58mA | - | Surface Mount | 0.276 L x 0.197 W (7.00mm x 5.00mm) |
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|
DSC1102AI5-400.0000MEMS OSC LOW JITTER 400MHZ LVPEC Microchip Technology |
2,322 | - |
RFQ |
Scheda tecnica |
6-VDFN Exposed Pad | Tube | DSC1102 | Active | MEMS | XO (Standard) | 400 MHz | Standby (Power Down) | LVPECL | 2.25V ~ 3.6V | ±10ppm | - | -40°C ~ 85°C | - | 58mA | - | Surface Mount | 0.276 L x 0.197 W (7.00mm x 5.00mm) |
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DSC1102AI5-400.0000TMEMS OSC LOW JITTER 400MHZ LVPEC Microchip Technology |
3,804 | - |
RFQ |
Scheda tecnica |
6-VDFN Exposed Pad | Tape & Reel (TR) | DSC1102 | Active | MEMS | XO (Standard) | 400 MHz | Standby (Power Down) | LVPECL | 2.25V ~ 3.6V | ±10ppm | - | -40°C ~ 85°C | - | 58mA | - | Surface Mount | 0.276 L x 0.197 W (7.00mm x 5.00mm) |
|
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DSC1102CI5-020.0000MEMS OSC LOW JITTER 20MHZ LVPECL Microchip Technology |
2,055 | - |
RFQ |
Scheda tecnica |
6-VDFN | Tube | DSC1102 | Active | MEMS | XO (Standard) | 20 MHz | Standby (Power Down) | LVPECL | 2.25V ~ 3.6V | ±10ppm | - | -40°C ~ 85°C | - | 58mA | - | Surface Mount | 0.126 L x 0.098 W (3.20mm x 2.50mm) |
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DSC1102CI5-020.0000TMEMS OSC LOW JITTER 20MHZ LVPECL Microchip Technology |
2,864 | - |
RFQ |
Scheda tecnica |
6-VDFN | Tape & Reel (TR) | DSC1102 | Active | MEMS | XO (Standard) | 20 MHz | Standby (Power Down) | LVPECL | 2.25V ~ 3.6V | ±10ppm | - | -40°C ~ 85°C | - | 58mA | - | Surface Mount | 0.126 L x 0.098 W (3.20mm x 2.50mm) |
|
|
DSC1102NI5-200.0000MEMS OSC LOW JITTER 200MHZ LVPEC Microchip Technology |
2,154 | - |
RFQ |
Scheda tecnica |
6-VDFN | Tube | DSC1102 | Active | MEMS | XO (Standard) | 200 MHz | Standby (Power Down) | LVPECL | 2.25V ~ 3.6V | ±10ppm | - | -40°C ~ 85°C | - | 58mA | - | Surface Mount | 0.276 L x 0.197 W (7.00mm x 5.00mm) |
|
|
DSC1102NI5-200.0000TMEMS OSC LOW JITTER 200MHZ LVPEC Microchip Technology |
2,179 | - |
RFQ |
Scheda tecnica |
6-VDFN | Tape & Reel (TR) | DSC1102 | Active | MEMS | XO (Standard) | 200 MHz | Standby (Power Down) | LVPECL | 2.25V ~ 3.6V | ±10ppm | - | -40°C ~ 85°C | - | 58mA | - | Surface Mount | 0.276 L x 0.197 W (7.00mm x 5.00mm) |
|
|
DSC1102NI5-400.0000MEMS OSC LOW JITTER 400MHZ LVPEC Microchip Technology |
2,434 | - |
RFQ |
Scheda tecnica |
6-VDFN | Tube | DSC1102 | Active | MEMS | XO (Standard) | 400 MHz | Standby (Power Down) | LVPECL | 2.25V ~ 3.6V | ±10ppm | - | -40°C ~ 85°C | - | 58mA | - | Surface Mount | 0.276 L x 0.197 W (7.00mm x 5.00mm) |
|
|
DSC1102NI5-400.0000TMEMS OSC LOW JITTER 400MHZ LVPEC Microchip Technology |
3,631 | - |
RFQ |
Scheda tecnica |
6-VDFN | Tape & Reel (TR) | DSC1102 | Active | MEMS | XO (Standard) | 400 MHz | Standby (Power Down) | LVPECL | 2.25V ~ 3.6V | ±10ppm | - | -40°C ~ 85°C | - | 58mA | - | Surface Mount | 0.276 L x 0.197 W (7.00mm x 5.00mm) |
|
|
DSC1103AE3-416.0000MEMS OSC LOW JITTER 416MHZ LVDS Microchip Technology |
2,854 | - |
RFQ |
Scheda tecnica |
6-VDFN Exposed Pad | Tube | DSC1103 | Active | MEMS | XO (Standard) | 416 MHz | Standby (Power Down) | LVDS | 2.25V ~ 3.63V | ±20ppm | - | -20°C ~ 70°C | - | 32mA | - | Surface Mount | 0.276 L x 0.197 W (7.00mm x 5.00mm) |
|
|
DSC1103AE3-416.0000TMEMS OSC LOW JITTER 416MHZ LVDS Microchip Technology |
3,377 | - |
RFQ |
Scheda tecnica |
6-VDFN Exposed Pad | Tape & Reel (TR) | DSC1103 | Active | MEMS | XO (Standard) | 416 MHz | Standby (Power Down) | LVDS | 2.25V ~ 3.63V | ±20ppm | - | -20°C ~ 70°C | - | 32mA | - | Surface Mount | 0.276 L x 0.197 W (7.00mm x 5.00mm) |
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|
DSC1103AI5-180.0000MEMS OSC LOW JITTER 180MHZ LVDS Microchip Technology |
2,322 | - |
RFQ |
Scheda tecnica |
6-VDFN Exposed Pad | Tube | DSC1103 | Active | MEMS | XO (Standard) | 180 MHz | Standby (Power Down) | LVDS | 2.25V ~ 3.63V | ±10ppm | - | -40°C ~ 85°C | - | 32mA | - | Surface Mount | 0.276 L x 0.197 W (7.00mm x 5.00mm) |
|
|
DSC1103AI5-180.0000TMEMS OSC LOW JITTER 180MHZ LVDS Microchip Technology |
3,478 | - |
RFQ |
Scheda tecnica |
6-VDFN Exposed Pad | Tape & Reel (TR) | DSC1103 | Active | MEMS | XO (Standard) | 180 MHz | Standby (Power Down) | LVDS | 2.25V ~ 3.63V | ±10ppm | - | -40°C ~ 85°C | - | 32mA | - | Surface Mount | 0.276 L x 0.197 W (7.00mm x 5.00mm) |
|
DSC6003MI3B-012.0000MEMS OSC ULP LVCMOS -40C-85C 20P Microchip Technology |
2,425 | - |
RFQ |
Scheda tecnica |
4-VFLGA | Bag | DSC60XXB | Active | MEMS | XO (Standard) | 12 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±20ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
|
DSC6003MI3B-012.0000TMEMS OSC ULP LVCMOS -40C-85C 20P Microchip Technology |
3,692 | - |
RFQ |
Scheda tecnica |
4-VFLGA | Tape & Reel (TR) | DSC60XXB | Active | MEMS | XO (Standard) | 12 MHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±20ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
|
DSC6003MI3B-032K768MEMS OSC ULP LVCMOS -40C-85C 20P Microchip Technology |
3,183 | - |
RFQ |
Scheda tecnica |
4-VFLGA | Bag | DSC60XXB | Active | MEMS | XO (Standard) | 32.768 kHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±20ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
|
DSC6003MI3B-032K768TMEMS OSC ULP LVCMOS -40C-85C 20P Microchip Technology |
2,840 | - |
RFQ |
Scheda tecnica |
4-VFLGA | Tape & Reel (TR) | DSC60XXB | Active | MEMS | XO (Standard) | 32.768 kHz | Enable/Disable | CMOS | 1.71V ~ 3.63V | ±20ppm | - | -40°C ~ 85°C | - | 1.3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
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