Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
517-83-364-17-091111

517-83-364-17-091111

CONN SOCKET PGA 364POS GOLD

Preci-Dip
2,541 -

RFQ

517-83-364-17-091111

Scheda tecnica

Bulk 517 Active PGA 364 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-192M16-001152

550-10-192M16-001152

BGA SOLDER TAIL

Preci-Dip
3,886 -

RFQ

550-10-192M16-001152

Scheda tecnica

Bulk 550 Active BGA 192 (16 x 16) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
517-83-369-18-091111

517-83-369-18-091111

CONN SOCKET PGA 369POS GOLD

Preci-Dip
3,190 -

RFQ

517-83-369-18-091111

Scheda tecnica

Bulk 517 Active PGA 369 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-257-20-111117

514-87-257-20-111117

CONN SOCKET PGA 257POS GOLD

Preci-Dip
3,103 -

RFQ

514-87-257-20-111117

Scheda tecnica

Bulk 514 Active PGA 257 (20 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-225-18-091101

550-80-225-18-091101

PGA SOLDER TAIL

Preci-Dip
2,851 -

RFQ

550-80-225-18-091101

Scheda tecnica

Bulk 550 Active PGA 225 (18 x 18) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-175-16-072112

614-83-175-16-072112

CONN SOCKET PGA 175POS GOLD

Preci-Dip
2,912 -

RFQ

614-83-175-16-072112

Scheda tecnica

Bulk 614 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-528-21-121111

517-87-528-21-121111

CONN SOCKET PGA 528POS GOLD

Preci-Dip
2,787 -

RFQ

517-87-528-21-121111

Scheda tecnica

Bulk 517 Active PGA 528 (21 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-529-21-121111

517-87-529-21-121111

CONN SOCKET PGA 529POS GOLD

Preci-Dip
2,820 -

RFQ

517-87-529-21-121111

Scheda tecnica

Bulk 517 Active PGA 529 (21 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-223-18-091117

514-83-223-18-091117

CONN SOCKET PGA 223POS GOLD

Preci-Dip
2,752 -

RFQ

514-83-223-18-091117

Scheda tecnica

Bulk 514 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-179-18-111112

614-83-179-18-111112

CONN SOCKET PGA 179POS GOLD

Preci-Dip
3,872 -

RFQ

614-83-179-18-111112

Scheda tecnica

Bulk 614 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-179-18-112112

614-83-179-18-112112

CONN SOCKET PGA 179POS GOLD

Preci-Dip
2,075 -

RFQ

614-83-179-18-112112

Scheda tecnica

Bulk 614 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-419-19-001154

514-87-419-19-001154

CONN SOCKET PGA 419POS GOLD

Preci-Dip
2,757 -

RFQ

514-87-419-19-001154

Scheda tecnica

Bulk 514 Active PGA 419 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-179-15-041112

614-83-179-15-041112

CONN SOCKET PGA 179POS GOLD

Preci-Dip
2,086 -

RFQ

614-83-179-15-041112

Scheda tecnica

Bulk 614 Active PGA 179 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-255M16-001148

514-87-255M16-001148

CONN SOCKET BGA 255POS GOLD

Preci-Dip
3,563 -

RFQ

514-87-255M16-001148

Scheda tecnica

Bulk 514 Active BGA 255 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-83-391-18-101111

517-83-391-18-101111

CONN SOCKET PGA 391POS GOLD

Preci-Dip
3,402 -

RFQ

517-83-391-18-101111

Scheda tecnica

Bulk 517 Active PGA 391 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-169-17-101101

550-10-169-17-101101

PGA SOLDER TAIL

Preci-Dip
3,536 -

RFQ

550-10-169-17-101101

Scheda tecnica

Bulk 550 Active PGA 169 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-539-20-101111

517-87-539-20-101111

CONN SOCKET PGA 539POS GOLD

Preci-Dip
3,328 -

RFQ

517-87-539-20-101111

Scheda tecnica

Bulk 517 Active PGA 539 (20 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-256M16-000148

514-87-256M16-000148

CONN SOCKET BGA 256POS GOLD

Preci-Dip
3,374 -

RFQ

514-87-256M16-000148

Scheda tecnica

Bulk 514 Active BGA 256 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-256M20-001148

514-87-256M20-001148

CONN SOCKET BGA 256POS GOLD

Preci-Dip
2,348 -

RFQ

514-87-256M20-001148

Scheda tecnica

Bulk 514 Active BGA 256 (20 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-192M16-001101

558-10-192M16-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip
3,619 -

RFQ

558-10-192M16-001101

Scheda tecnica

Bulk 558 Active PGA 192 (16 x 16) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
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1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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