Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
558-10-192M16-001104

558-10-192M16-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip
3,651 -

RFQ

558-10-192M16-001104

Scheda tecnica

Bulk 558 Active BGA 192 (16 x 16) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-192M16-001105

518-77-192M16-001105

CONN SOCKET PGA 192POS GOLD

Preci-Dip
3,958 -

RFQ

518-77-192M16-001105

Scheda tecnica

Bulk 518 Active PGA 192 (16 x 16) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
518-77-192M16-001106

518-77-192M16-001106

CONN SOCKET PGA 192POS GOLD

Preci-Dip
3,444 -

RFQ

518-77-192M16-001106

Scheda tecnica

Bulk 518 Active PGA 192 (16 x 16) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
517-83-401-19-101111

517-83-401-19-101111

CONN SOCKET PGA 401POS GOLD

Preci-Dip
3,528 -

RFQ

517-83-401-19-101111

Scheda tecnica

Bulk 517 Active PGA 401 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-304-14-051147

546-87-304-14-051147

CONN SOCKET PGA 304POS GOLD

Preci-Dip
3,403 -

RFQ

546-87-304-14-051147

Scheda tecnica

Bulk 546 Active PGA 304 (14 x 14) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-83-403-19-111111

517-83-403-19-111111

CONN SOCKET PGA 403POS GOLD

Preci-Dip
2,792 -

RFQ

517-83-403-19-111111

Scheda tecnica

Bulk 517 Active PGA 403 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-191-18-091101

550-10-191-18-091101

PGA SOLDER TAIL

Preci-Dip
3,400 -

RFQ

550-10-191-18-091101

Scheda tecnica

Bulk 550 Active PGA 191 (18 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-299-20-001117

514-87-299-20-001117

CONN SOCKET PGA 299POS GOLD

Preci-Dip
2,515 -

RFQ

514-87-299-20-001117

Scheda tecnica

Bulk 514 Active PGA 299 (20 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-599-54-131111

517-87-599-54-131111

CONN SOCKET PGA 599POS GOLD

Preci-Dip
2,038 -

RFQ

517-87-599-54-131111

Scheda tecnica

Bulk 517 Active PGA 599 (54 x 54) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-360M19-001166

550-10-360M19-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
2,037 -

RFQ

550-10-360M19-001166

Scheda tecnica

Bulk 550 Active BGA 360 (19 x 19) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
550-10-352M26-001166

550-10-352M26-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
2,327 -

RFQ

550-10-352M26-001166

Scheda tecnica

Bulk 550 Active BGA 352 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
517-83-411-20-111111

517-83-411-20-111111

CONN SOCKET PGA 411POS GOLD

Preci-Dip
3,895 -

RFQ

517-83-411-20-111111

Scheda tecnica

Bulk 517 Active PGA 411 (20 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-292M20-001148

514-87-292M20-001148

CONN SOCKET BGA 292POS GOLD

Preci-Dip
2,059 -

RFQ

514-87-292M20-001148

Scheda tecnica

Bulk 514 Active BGA 292 (20 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-83-419-19-111111

517-83-419-19-111111

CONN SOCKET PGA 419POS GOLD

Preci-Dip
2,342 -

RFQ

517-83-419-19-111111

Scheda tecnica

Bulk 517 Active PGA 419 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-238-19-101112

614-87-238-19-101112

CONN SOCKET PGA 238POS GOLD

Preci-Dip
3,911 -

RFQ

614-87-238-19-101112

Scheda tecnica

Bulk 614 Active PGA 238 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-83-420-19-111111

517-83-420-19-111111

CONN SOCKET PGA 420POS GOLD

Preci-Dip
3,890 -

RFQ

517-83-420-19-111111

Scheda tecnica

Bulk 517 Active PGA 420 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-321-17-101147

546-87-321-17-101147

CONN SOCKET PGA 321POS GOLD

Preci-Dip
2,780 -

RFQ

546-87-321-17-101147

Scheda tecnica

Bulk 546 Active PGA 321 (17 x 17) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-83-429-19-101111

517-83-429-19-101111

CONN SOCKET PGA 429POS GOLD

Preci-Dip
3,970 -

RFQ

517-83-429-19-101111

Scheda tecnica

Bulk 517 Active PGA 429 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-83-428-19-101111

517-83-428-19-101111

CONN SOCKET PGA 428POS GOLD

Preci-Dip
3,005 -

RFQ

517-83-428-19-101111

Scheda tecnica

Bulk 517 Active PGA 428 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-325-18-111147

546-87-325-18-111147

CONN SOCKET PGA 325POS GOLD

Preci-Dip
2,845 -

RFQ

546-87-325-18-111147

Scheda tecnica

Bulk 546 Active PGA 325 (18 x 18) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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