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| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
410-87-224-10-001101CONN ZIG-ZAG 24POS GOLD Preci-Dip |
2,433 | - |
RFQ |
Scheda tecnica |
Bulk | 410 | Active | Zig-Zag, Left Stackable | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
410-87-224-10-002101CONN ZIG-ZAG 24POS GOLD Preci-Dip |
2,476 | - |
RFQ |
Scheda tecnica |
Bulk | 410 | Active | Zig-Zag, Right Stackable | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
122-87-314-41-001101CONN IC DIP SOCKET 14POS GOLD Preci-Dip |
3,077 | - |
RFQ |
Scheda tecnica |
Bulk | 122 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-318-41-018101CONN IC DIP SOCKET 18POS GOLD Preci-Dip |
3,961 | - |
RFQ |
Scheda tecnica |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-308-41-011101CONN IC DIP SOCKET 8POS GOLD Preci-Dip |
2,571 | - |
RFQ |
Scheda tecnica |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-210-41-008101CONN IC DIP SOCKET 10POS GOLD Preci-Dip |
3,154 | - |
RFQ |
Scheda tecnica |
Bulk | 116 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-310-41-008101CONN IC DIP SOCKET 10POS GOLD Preci-Dip |
2,849 | - |
RFQ |
Scheda tecnica |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
614-87-318-31-012101CONN IC DIP SOCKET 18POS GOLD Preci-Dip |
2,782 | - |
RFQ |
Scheda tecnica |
Bulk | 614 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
612-87-320-41-001101CONN IC DIP SOCKET 20POS GOLD Preci-Dip |
3,364 | - |
RFQ |
Scheda tecnica |
Bulk | 612 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-310-41-011101CONN IC DIP SOCKET 10POS GOLD Preci-Dip |
2,474 | - |
RFQ |
Scheda tecnica |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
410-83-216-10-001101CONN ZIG-ZAG 16POS GOLD Preci-Dip |
3,960 | - |
RFQ |
Scheda tecnica |
Bulk | 410 | Active | Zig-Zag, Left Stackable | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
410-83-216-10-002101CONN ZIG-ZAG 16POS GOLD Preci-Dip |
2,974 | - |
RFQ |
Scheda tecnica |
Bulk | 410 | Active | Zig-Zag, Right Stackable | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-314-41-007101CONN IC DIP SOCKET 14POS GOLD Preci-Dip |
3,109 | - |
RFQ |
Scheda tecnica |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-610-41-002101CONN IC DIP SOCKET 10POS GOLD Preci-Dip |
3,502 | - |
RFQ |
Scheda tecnica |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
115-87-328-41-001101CONN IC DIP SOCKET 28POS GOLD Preci-Dip |
2,183 | - |
RFQ |
Bulk | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
|
510-83-025-05-000101CONN SOCKET PGA 25POS GOLD Preci-Dip |
2,407 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 25 (5 x 5) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
540-88-032-24-008CONN SOCKET PLCC 32POS TIN Preci-Dip |
3,490 | - |
RFQ |
Scheda tecnica |
Bulk | 540 | Active | PLCC | 32 (4 x 8) | 0.050 (1.27mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polyphenylene Sulfide (PPS) |
|
115-83-318-41-003101CONN IC DIP SOCKET 18POS GOLD Preci-Dip |
2,226 | - |
RFQ |
Scheda tecnica |
Bulk | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-312-41-012101CONN IC DIP SOCKET 12POS GOLD Preci-Dip |
2,659 | - |
RFQ |
Scheda tecnica |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-314-41-018101CONN IC DIP SOCKET 14POS GOLD Preci-Dip |
2,619 | - |
RFQ |
Scheda tecnica |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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