Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-87-628-41-007101

116-87-628-41-007101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,347 -

RFQ

116-87-628-41-007101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-432-41-006101

116-83-432-41-006101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,178 -

RFQ

116-83-432-41-006101

Scheda tecnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-640-41-105101

117-87-640-41-105101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,714 -

RFQ

117-87-640-41-105101

Scheda tecnica

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-628-41-001101

121-83-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,020 -

RFQ

121-83-628-41-001101

Scheda tecnica

Bulk 121 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-664-41-005101

117-87-664-41-005101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip
2,957 -

RFQ

117-87-664-41-005101

Scheda tecnica

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
217-87-764-41-005101

217-87-764-41-005101

DIL SOLDER TAIL 1.778MM

Preci-Dip
2,725 -

RFQ

- 217 Active - - - - - - - - - - - - - -
510-87-088-12-052101

510-87-088-12-052101

CONN SOCKET PGA 88POS GOLD

Preci-Dip
2,496 -

RFQ

510-87-088-12-052101

Scheda tecnica

Bulk 510 Active PGA 88 (12 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-088-13-062101

510-87-088-13-062101

CONN SOCKET PGA 88POS GOLD

Preci-Dip
2,611 -

RFQ

510-87-088-13-062101

Scheda tecnica

Bulk 510 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-088-13-081101

510-87-088-13-081101

CONN SOCKET PGA 88POS GOLD

Preci-Dip
3,568 -

RFQ

510-87-088-13-081101

Scheda tecnica

Bulk 510 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-432-41-001101

122-87-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,605 -

RFQ

122-87-432-41-001101

Scheda tecnica

Bulk 122 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-432-41-001101

123-87-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,053 -

RFQ

123-87-432-41-001101

Scheda tecnica

Bulk 123 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-088-12-051101

510-87-088-12-051101

CONN SOCKET PGA 88POS GOLD

Preci-Dip
3,448 -

RFQ

510-87-088-12-051101

Scheda tecnica

Bulk 510 Active PGA 88 (12 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-088-13-001101

510-87-088-13-001101

CONN SOCKET PGA 88POS GOLD

Preci-Dip
2,081 -

RFQ

510-87-088-13-001101

Scheda tecnica

Bulk 510 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-628-41-001101

122-87-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,060 -

RFQ

122-87-628-41-001101

Scheda tecnica

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-628-41-001101

123-87-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,057 -

RFQ

123-87-628-41-001101

Scheda tecnica

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-312-41-013101

116-83-312-41-013101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,106 -

RFQ

116-83-312-41-013101

Scheda tecnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-632-41-018101

116-83-632-41-018101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,360 -

RFQ

116-83-632-41-018101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-422-41-011101

116-87-422-41-011101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,483 -

RFQ

116-87-422-41-011101

Scheda tecnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-097-11-041101

510-87-097-11-041101

CONN SOCKET PGA 97POS GOLD

Preci-Dip
2,335 -

RFQ

510-87-097-11-041101

Scheda tecnica

Bulk 510 Active PGA 97 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-432-41-105101

110-83-432-41-105101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,223 -

RFQ

110-83-432-41-105101

Scheda tecnica

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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