Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-83-648-41-001101

110-83-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,865 -

RFQ

110-83-648-41-001101

Scheda tecnica

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-648-41-001151

110-83-648-41-001151

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,552 -

RFQ

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-642-41-018101

116-87-642-41-018101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,267 -

RFQ

116-87-642-41-018101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-648-41-105101

110-87-648-41-105101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,124 -

RFQ

110-87-648-41-105101

Scheda tecnica

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-648-41-001101

614-87-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,820 -

RFQ

614-87-648-41-001101

Scheda tecnica

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-624-41-002101

116-83-624-41-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,189 -

RFQ

116-83-624-41-002101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-640-41-003101

116-87-640-41-003101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,756 -

RFQ

116-87-640-41-003101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-318-11-001101

299-87-318-11-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,211 -

RFQ

299-87-318-11-001101

Scheda tecnica

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-964-41-001101

110-87-964-41-001101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip
3,786 -

RFQ

110-87-964-41-001101

Scheda tecnica

Bulk 110 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-652-41-005101

117-83-652-41-005101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,180 -

RFQ

117-83-652-41-005101

Scheda tecnica

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-650-41-006101

116-87-650-41-006101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
3,327 -

RFQ

116-87-650-41-006101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-068-10-001101

510-83-068-10-001101

CONN SOCKET PGA 68POS GOLD

Preci-Dip
3,096 -

RFQ

510-83-068-10-001101

Scheda tecnica

Bulk 510 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-640-41-001101

614-83-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,444 -

RFQ

614-83-640-41-001101

Scheda tecnica

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-628-41-002101

116-83-628-41-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,213 -

RFQ

116-83-628-41-002101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-428-41-002101

116-83-428-41-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,731 -

RFQ

116-83-428-41-002101

Scheda tecnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-624-41-001101

116-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,019 -

RFQ

116-83-624-41-001101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-428-41-105101

110-83-428-41-105101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,438 -

RFQ

110-83-428-41-105101

Scheda tecnica

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-642-41-117101

114-83-642-41-117101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,215 -

RFQ

114-83-642-41-117101

Scheda tecnica

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-642-41-134161

114-83-642-41-134161

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,480 -

RFQ

114-83-642-41-134161

Scheda tecnica

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-064-01-505101

110-87-064-01-505101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip
3,554 -

RFQ

110-87-064-01-505101

Scheda tecnica

Bulk 110 Active - 64 (2 x 32) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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