Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-089-12-051101

510-83-089-12-051101

CONN SOCKET PGA 89POS GOLD

Preci-Dip
3,150 -

RFQ

510-83-089-12-051101

Scheda tecnica

Bulk 510 Active PGA 89 (12 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-089-13-082101

510-83-089-13-082101

CONN SOCKET PGA 89POS GOLD

Preci-Dip
2,197 -

RFQ

510-83-089-13-082101

Scheda tecnica

Bulk 510 Active PGA 89 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-084-12-051101

510-83-084-12-051101

CONN SOCKET PGA 84POS GOLD

Preci-Dip
3,537 -

RFQ

510-83-084-12-051101

Scheda tecnica

Bulk 510 Active PGA 84 (12 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-084-13-081101

510-83-084-13-081101

CONN SOCKET PGA 84POS GOLD

Preci-Dip
3,095 -

RFQ

510-83-084-13-081101

Scheda tecnica

Bulk 510 Active PGA 84 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-084-13-082101

510-83-084-13-082101

CONN SOCKET PGA 84POS GOLD

Preci-Dip
2,864 -

RFQ

510-83-084-13-082101

Scheda tecnica

Bulk 510 Active PGA 84 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-652-41-006101

116-83-652-41-006101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,036 -

RFQ

116-83-652-41-006101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-964-41-005101

110-83-964-41-005101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip
2,586 -

RFQ

110-83-964-41-005101

Scheda tecnica

Bulk 110 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-324-10-001101

299-87-324-10-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,822 -

RFQ

299-87-324-10-001101

Scheda tecnica

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-064-01-505101

110-83-064-01-505101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip
3,351 -

RFQ

110-83-064-01-505101

Scheda tecnica

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-648-31-012101

614-83-648-31-012101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,342 -

RFQ

614-83-648-31-012101

Scheda tecnica

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-952-41-001101

614-83-952-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,952 -

RFQ

614-83-952-41-001101

Scheda tecnica

Bulk 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-642-41-009101

116-87-642-41-009101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,571 -

RFQ

116-87-642-41-009101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-096-11-041101

510-83-096-11-041101

CONN SOCKET PGA 96POS GOLD

Preci-Dip
3,002 -

RFQ

510-83-096-11-041101

Scheda tecnica

Bulk 510 Active PGA 96 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-650-41-018101

116-83-650-41-018101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
3,295 -

RFQ

116-83-650-41-018101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-143-15-081101

510-87-143-15-081101

CONN SOCKET PGA 143POS GOLD

Preci-Dip
3,468 -

RFQ

510-87-143-15-081101

Scheda tecnica

Bulk 510 Active PGA 143 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-648-41-006101

116-83-648-41-006101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,549 -

RFQ

116-83-648-41-006101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-648-41-003101

116-83-648-41-003101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,473 -

RFQ

116-83-648-41-003101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-144-15-081101

510-87-144-15-081101

CONN SOCKET PGA 144POS GOLD

Preci-Dip
3,883 -

RFQ

510-87-144-15-081101

Scheda tecnica

Bulk 510 Active PGA 144 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-648-41-035101

146-87-648-41-035101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,822 -

RFQ

146-87-648-41-035101

Scheda tecnica

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-648-41-036101

146-87-648-41-036101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,461 -

RFQ

146-87-648-41-036101

Scheda tecnica

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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