Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-87-432-41-004101

116-87-432-41-004101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,516 -

RFQ

116-87-432-41-004101

Scheda tecnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-148-15-061101

510-87-148-15-061101

CONN SOCKET PGA 148POS GOLD

Preci-Dip
2,125 -

RFQ

510-87-148-15-061101

Scheda tecnica

Bulk 510 Active PGA 148 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-148-15-062101

510-87-148-15-062101

CONN SOCKET PGA 148POS GOLD

Preci-Dip
2,079 -

RFQ

510-87-148-15-062101

Scheda tecnica

Bulk 510 Active PGA 148 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-950-31-012101

614-83-950-31-012101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
3,852 -

RFQ

614-83-950-31-012101

Scheda tecnica

Bulk 614 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-652-41-018101

116-83-652-41-018101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,209 -

RFQ

116-83-652-41-018101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-324-11-001101

299-83-324-11-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,489 -

RFQ

299-83-324-11-001101

Scheda tecnica

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-100-10-000101

510-83-100-10-000101

CONN SOCKET PGA 100POS GOLD

Preci-Dip
2,815 -

RFQ

510-83-100-10-000101

Scheda tecnica

Bulk 510 Active PGA 100 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-149-15-003101

510-87-149-15-003101

CONN SOCKET PGA 149POS GOLD

Preci-Dip
2,611 -

RFQ

510-87-149-15-003101

Scheda tecnica

Bulk 510 Active PGA 149 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-149-15-061101

510-87-149-15-061101

CONN SOCKET PGA 149POS GOLD

Preci-Dip
2,610 -

RFQ

510-87-149-15-061101

Scheda tecnica

Bulk 510 Active PGA 149 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-149-15-063101

510-87-149-15-063101

CONN SOCKET PGA 149POS GOLD

Preci-Dip
3,215 -

RFQ

510-87-149-15-063101

Scheda tecnica

Bulk 510 Active PGA 149 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-149-15-064101

510-87-149-15-064101

CONN SOCKET PGA 149POS GOLD

Preci-Dip
2,248 -

RFQ

510-87-149-15-064101

Scheda tecnica

Bulk 510 Active PGA 149 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-642-41-001101

122-83-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,593 -

RFQ

122-83-642-41-001101

Scheda tecnica

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-642-41-001101

123-83-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,221 -

RFQ

123-83-642-41-001101

Scheda tecnica

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-044-08-031112

614-87-044-08-031112

CONN SOCKET PGA 44POS GOLD

Preci-Dip
3,327 -

RFQ

614-87-044-08-031112

Scheda tecnica

Bulk 614 Active PGA 44 (8 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-650-41-003101

116-83-650-41-003101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,653 -

RFQ

116-83-650-41-003101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-650-41-035101

146-87-650-41-035101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,901 -

RFQ

146-87-650-41-035101

Scheda tecnica

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-650-41-036101

146-87-650-41-036101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,546 -

RFQ

146-87-650-41-036101

Scheda tecnica

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-624-41-004101

116-83-624-41-004101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,497 -

RFQ

116-83-624-41-004101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-640-41-007101

116-83-640-41-007101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,406 -

RFQ

116-83-640-41-007101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-160-13-001101

510-87-160-13-001101

CONN SOCKET PGA 160POS GOLD

Preci-Dip
2,536 -

RFQ

510-87-160-13-001101

Scheda tecnica

Bulk 510 Active PGA 160 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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