Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-87-168-17-001101

510-87-168-17-001101

CONN SOCKET PGA 168POS GOLD

Preci-Dip
2,631 -

RFQ

510-87-168-17-001101

Scheda tecnica

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-168-17-101101

510-87-168-17-101101

CONN SOCKET PGA 168POS GOLD

Preci-Dip
2,354 -

RFQ

510-87-168-17-101101

Scheda tecnica

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-168-17-102101

510-87-168-17-102101

CONN SOCKET PGA 168POS GOLD

Preci-Dip
3,878 -

RFQ

510-87-168-17-102101

Scheda tecnica

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-100-13-061101

510-83-100-13-061101

CONN SOCKET PGA 100POS GOLD

Preci-Dip
2,007 -

RFQ

510-83-100-13-061101

Scheda tecnica

Bulk 510 Active PGA 100 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-159-16-071101

510-87-159-16-071101

CONN SOCKET PGA 159POS GOLD

Preci-Dip
3,050 -

RFQ

510-87-159-16-071101

Scheda tecnica

Bulk 510 Active PGA 159 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-648-41-012101

116-83-648-41-012101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,228 -

RFQ

116-83-648-41-012101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-964-41-001101

612-87-964-41-001101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip
2,989 -

RFQ

612-87-964-41-001101

Scheda tecnica

Bulk 612 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-160-15-061101

510-87-160-15-061101

CONN SOCKET PGA 160POS GOLD

Preci-Dip
3,263 -

RFQ

510-87-160-15-061101

Scheda tecnica

Bulk 510 Active PGA 160 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-160-16-081101

510-87-160-16-081101

CONN SOCKET PGA 160POS GOLD

Preci-Dip
3,349 -

RFQ

510-87-160-16-081101

Scheda tecnica

Bulk 510 Active PGA 160 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-620-10-002101

299-87-620-10-002101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,953 -

RFQ

299-87-620-10-002101

Scheda tecnica

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-101-13-001101

510-83-101-13-001101

CONN SOCKET PGA 101POS GOLD

Preci-Dip
2,744 -

RFQ

510-83-101-13-001101

Scheda tecnica

Bulk 510 Active PGA 101 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-101-13-061101

510-83-101-13-061101

CONN SOCKET PGA 101POS GOLD

Preci-Dip
3,557 -

RFQ

510-83-101-13-061101

Scheda tecnica

Bulk 510 Active PGA 101 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-101-11-001101

510-83-101-11-001101

CONN SOCKET PGA 101POS GOLD

Preci-Dip
3,554 -

RFQ

510-83-101-11-001101

Scheda tecnica

Bulk 510 Active PGA 101 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-628-41-004101

116-87-628-41-004101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,098 -

RFQ

116-87-628-41-004101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-640-41-008101

116-83-640-41-008101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,295 -

RFQ

116-83-640-41-008101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-640-41-011101

116-87-640-41-011101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,943 -

RFQ

116-87-640-41-011101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-648-41-001101

122-87-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,630 -

RFQ

122-87-648-41-001101

Scheda tecnica

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-648-41-001101

123-87-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,883 -

RFQ

123-87-648-41-001101

Scheda tecnica

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-175-14-001101

510-87-175-14-001101

CONN SOCKET PGA 175POS GOLD

Preci-Dip
2,527 -

RFQ

510-87-175-14-001101

Scheda tecnica

Bulk 510 Active PGA 175 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-642-41-002101

116-83-642-41-002101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,985 -

RFQ

116-83-642-41-002101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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