Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-108-12-051101

510-83-108-12-051101

CONN SOCKET PGA 108POS GOLD

Preci-Dip
3,604 -

RFQ

510-83-108-12-051101

Scheda tecnica

Bulk 510 Active PGA 108 (12 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-652-41-009101

116-87-652-41-009101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
2,712 -

RFQ

116-87-652-41-009101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-172-16-001101

510-87-172-16-001101

CONN SOCKET PGA 172POS GOLD

Preci-Dip
3,861 -

RFQ

510-87-172-16-001101

Scheda tecnica

Bulk 510 Active PGA 172 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-648-41-007101

116-87-648-41-007101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,687 -

RFQ

116-87-648-41-007101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-109-12-051101

510-83-109-12-051101

CONN SOCKET PGA 109POS GOLD

Preci-Dip
2,962 -

RFQ

510-83-109-12-051101

Scheda tecnica

Bulk 510 Active PGA 109 (12 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-174-17-061101

510-87-174-17-061101

CONN SOCKET PGA 174POS GOLD

Preci-Dip
3,356 -

RFQ

510-87-174-17-061101

Scheda tecnica

Bulk 510 Active PGA 174 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-174-17-081101

510-87-174-17-081101

CONN SOCKET PGA 174POS GOLD

Preci-Dip
3,713 -

RFQ

510-87-174-17-081101

Scheda tecnica

Bulk 510 Active PGA 174 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-950-41-001101

612-83-950-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,942 -

RFQ

612-83-950-41-001101

Scheda tecnica

Bulk 612 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-175-15-061101

510-87-175-15-061101

CONN SOCKET PGA 175POS GOLD

Preci-Dip
3,891 -

RFQ

510-87-175-15-061101

Scheda tecnica

Bulk 510 Active PGA 175 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-175-16-001101

510-87-175-16-001101

CONN SOCKET PGA 175POS GOLD

Preci-Dip
3,373 -

RFQ

510-87-175-16-001101

Scheda tecnica

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-175-16-071101

510-87-175-16-071101

CONN SOCKET PGA 175POS GOLD

Preci-Dip
3,191 -

RFQ

510-87-175-16-071101

Scheda tecnica

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-175-16-072101

510-87-175-16-072101

CONN SOCKET PGA 175POS GOLD

Preci-Dip
3,838 -

RFQ

510-87-175-16-072101

Scheda tecnica

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-964-41-001101

614-83-964-41-001101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip
3,617 -

RFQ

614-83-964-41-001101

Scheda tecnica

Bulk 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-648-41-001101

121-83-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,008 -

RFQ

121-83-648-41-001101

Scheda tecnica

Bulk 121 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-176-16-001101

510-87-176-16-001101

CONN SOCKET PGA 176POS GOLD

Preci-Dip
2,325 -

RFQ

510-87-176-16-001101

Scheda tecnica

Bulk 510 Active PGA 176 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-176-16-071101

510-87-176-16-071101

CONN SOCKET PGA 176POS GOLD

Preci-Dip
3,601 -

RFQ

510-87-176-16-071101

Scheda tecnica

Bulk 510 Active PGA 176 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-176-15-061101

510-87-176-15-061101

CONN SOCKET PGA 176POS GOLD

Preci-Dip
3,028 -

RFQ

510-87-176-15-061101

Scheda tecnica

Bulk 510 Active PGA 176 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-622-10-002101

299-87-622-10-002101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,158 -

RFQ

299-87-622-10-002101

Scheda tecnica

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-636-41-002101

124-83-636-41-002101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,590 -

RFQ

Bulk 124 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-642-41-009101

116-83-642-41-009101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,512 -

RFQ

116-83-642-41-009101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 9293949596979899...142Next»
1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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