Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-83-652-41-003101

116-83-652-41-003101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
2,034 -

RFQ

116-83-652-41-003101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-156-15-061101

510-87-156-15-061101

CONN SOCKET PGA 156POS GOLD

Preci-Dip
3,426 -

RFQ

510-87-156-15-061101

Scheda tecnica

Bulk 510 Active PGA 156 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-156-15-062101

510-87-156-15-062101

CONN SOCKET PGA 156POS GOLD

Preci-Dip
3,013 -

RFQ

510-87-156-15-062101

Scheda tecnica

Bulk 510 Active PGA 156 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-156-16-091101

510-87-156-16-091101

CONN SOCKET PGA 156POS GOLD

Preci-Dip
2,788 -

RFQ

510-87-156-16-091101

Scheda tecnica

Bulk 510 Active PGA 156 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-652-41-035101

146-87-652-41-035101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
2,900 -

RFQ

146-87-652-41-035101

Scheda tecnica

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-652-41-036101

146-87-652-41-036101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
2,137 -

RFQ

146-87-652-41-036101

Scheda tecnica

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-650-41-008101

116-87-650-41-008101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
3,985 -

RFQ

116-87-650-41-008101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-156-16-001101

510-87-156-16-001101

CONN SOCKET PGA 156POS GOLD

Preci-Dip
3,513 -

RFQ

510-87-156-16-001101

Scheda tecnica

Bulk 510 Active PGA 156 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-652-41-105101

117-83-652-41-105101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,506 -

RFQ

117-83-652-41-105101

Scheda tecnica

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-640-41-002101

116-83-640-41-002101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,705 -

RFQ

116-83-640-41-002101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-448-41-105101

117-87-448-41-105101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,006 -

RFQ

117-87-448-41-105101

Scheda tecnica

Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 48 (2 x 24) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-652-41-002101

116-87-652-41-002101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
2,915 -

RFQ

116-87-652-41-002101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-642-41-007101

116-83-642-41-007101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,047 -

RFQ

116-83-642-41-007101

Scheda tecnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-100-13-062101

510-83-100-13-062101

CONN SOCKET PGA 100POS GOLD

Preci-Dip
3,068 -

RFQ

510-83-100-13-062101

Scheda tecnica

Bulk 510 Active PGA 100 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-100-13-063101

510-83-100-13-063101

CONN SOCKET PGA 100POS GOLD

Preci-Dip
3,391 -

RFQ

510-83-100-13-063101

Scheda tecnica

Bulk 510 Active PGA 100 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-100-13-064101

510-83-100-13-064101

CONN SOCKET PGA 100POS GOLD

Preci-Dip
3,752 -

RFQ

510-83-100-13-064101

Scheda tecnica

Bulk 510 Active PGA 100 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-169-13-000101

510-87-169-13-000101

CONN SOCKET PGA 169POS GOLD

Preci-Dip
2,624 -

RFQ

510-87-169-13-000101

Scheda tecnica

Bulk 510 Active PGA 169 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-642-41-035101

146-83-642-41-035101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,090 -

RFQ

146-83-642-41-035101

Scheda tecnica

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-642-41-036101

146-83-642-41-036101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,579 -

RFQ

146-83-642-41-036101

Scheda tecnica

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-668-41-105101

117-87-668-41-105101

CONN IC DIP SOCKET 68POS GOLD

Preci-Dip
3,634 -

RFQ

117-87-668-41-105101

Scheda tecnica

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 68 (2 x 34) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 8990919293949596...142Next»
1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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