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| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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03-7630-10CONN SOCKET SIP 3POS TIN Aries Electronics |
2,914 | - |
RFQ |
Scheda tecnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 3 (1 x 3) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
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|
03-7880-10CONN SOCKET SIP 3POS TIN Aries Electronics |
3,895 | - |
RFQ |
Scheda tecnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 3 (1 x 3) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-0503-21CONN SOCKET SIP 10POS GOLD Aries Electronics |
2,733 | - |
RFQ |
Scheda tecnica |
Bulk | 0503 | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
10-0503-31CONN SOCKET SIP 10POS GOLD Aries Electronics |
3,981 | - |
RFQ |
Scheda tecnica |
Bulk | 0503 | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
24-6501-20CONN IC DIP SOCKET 24POS TIN Aries Electronics |
3,705 | - |
RFQ |
Scheda tecnica |
Bulk | 501 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-6501-30CONN IC DIP SOCKET 24POS TIN Aries Electronics |
2,580 | - |
RFQ |
Scheda tecnica |
Bulk | 501 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
510-83-168-17-001101CONN SOCKET PGA 168POS GOLD Preci-Dip |
3,789 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 168 (17 x 17) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-168-17-101101CONN SOCKET PGA 168POS GOLD Preci-Dip |
3,202 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 168 (17 x 17) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-168-17-102101CONN SOCKET PGA 168POS GOLD Preci-Dip |
2,644 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 168 (17 x 17) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
31-0518-11HCONN SOCKET SIP 31POS GOLD Aries Electronics |
3,613 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | SIP | 31 (1 x 31) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
35-0511-10CONN SOCKET SIP 35POS TIN Aries Electronics |
2,133 | - |
RFQ |
Scheda tecnica |
Bulk | 511 | Active | SIP | 35 (1 x 35) | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
299-99-210-12-001800CONN IC DIP SOCKET 10POS TINLEAD Mill-Max Manufacturing Corp. |
3,826 | - |
RFQ |
Scheda tecnica |
Tube | 299 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Beryllium Copper | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-83-179-15-041101CONN SOCKET PGA 179POS GOLD Preci-Dip |
2,733 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 179 (15 x 15) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-180-18-111101CONN SOCKET PGA 180POS GOLD Preci-Dip |
2,185 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 180 (18 x 18) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-83-068-10-061112CONN SOCKET PGA 68POS GOLD Preci-Dip |
2,728 | - |
RFQ |
Scheda tecnica |
Bulk | 614 | Active | PGA | 68 (10 x 10) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
31-0511-10CONN SOCKET SIP 31POS TIN Aries Electronics |
3,086 | - |
RFQ |
Scheda tecnica |
Bulk | 511 | Active | SIP | 31 (1 x 31) | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
19-0508-20CONN SOCKET SIP 19POS GOLD Aries Electronics |
3,244 | - |
RFQ |
Scheda tecnica |
Bulk | 508 | Active | SIP | 19 (1 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
19-0508-30CONN SOCKET SIP 19POS GOLD Aries Electronics |
2,962 | - |
RFQ |
Scheda tecnica |
Bulk | 508 | Active | SIP | 19 (1 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
40-6518-102CONN IC DIP SOCKET 40POS GOLD Aries Electronics |
3,079 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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|
346-93-148-41-013000CONN SOCKET SIP 48POS GOLD Mill-Max Manufacturing Corp. |
2,509 | - |
RFQ |
Scheda tecnica |
Bulk | 346 | Active | SIP | 48 (1 x 48) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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