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| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
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346-43-148-41-013000CONN SOCKET SIP 48POS GOLD Mill-Max Manufacturing Corp. |
3,308 | - |
RFQ |
Scheda tecnica |
Bulk | 346 | Active | SIP | 48 (1 x 48) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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510-83-180-15-002101CONN SOCKET PGA 180POS GOLD Preci-Dip |
3,011 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 180 (15 x 15) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-180-15-041101CONN SOCKET PGA 180POS GOLD Preci-Dip |
3,133 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 180 (15 x 15) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
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510-83-180-17-081101CONN SOCKET PGA 180POS GOLD Preci-Dip |
2,630 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 180 (17 x 17) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
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24-C182-11CONN IC DIP SOCKET 24POS GOLD Aries Electronics |
3,752 | - |
RFQ |
Scheda tecnica |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
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24-C212-11CONN IC DIP SOCKET 24POS GOLD Aries Electronics |
2,870 | - |
RFQ |
Scheda tecnica |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
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24-C300-11CONN IC DIP SOCKET 24POS GOLD Aries Electronics |
3,093 | - |
RFQ |
Scheda tecnica |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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27-0511-10CONN SOCKET SIP 27POS TIN Aries Electronics |
2,856 | - |
RFQ |
Scheda tecnica |
Bulk | 511 | Active | SIP | 27 (1 x 27) | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
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|
116-47-304-41-001000STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp. |
3,000 | - |
RFQ |
Scheda tecnica |
Tube | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
123-11-304-41-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,434 | - |
RFQ |
Scheda tecnica |
Tube | 123 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-83-180-14-031101CONN SOCKET PGA 180POS GOLD Preci-Dip |
3,168 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 180 (14 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-180-15-001101CONN SOCKET PGA 180POS GOLD Preci-Dip |
2,538 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 180 (15 x 15) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
08-2503-21CONN IC DIP SOCKET 8POS GOLD Aries Electronics |
3,186 | - |
RFQ |
Scheda tecnica |
Bulk | 503 | Active | DIP, 0.2 (5.08mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-2503-31CONN IC DIP SOCKET 8POS GOLD Aries Electronics |
2,315 | - |
RFQ |
Scheda tecnica |
Bulk | 503 | Active | DIP, 0.2 (5.08mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
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940-44-068-17-400004CONN SKT PLCC Mill-Max Manufacturing Corp. |
2,018 | - |
RFQ |
Scheda tecnica |
Tape & Reel (TR) | 940 | Active | PLCC | 68 (4 x 17) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
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510-83-181-17-082101CONN SOCKET PGA 181POS GOLD Preci-Dip |
3,147 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 181 (17 x 17) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-181-14-031101CONN SOCKET PGA 181POS GOLD Preci-Dip |
3,678 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 181 (14 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-181-15-001101CONN SOCKET PGA 181POS GOLD Preci-Dip |
2,948 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 181 (15 x 15) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-181-15-051101CONN SOCKET PGA 181POS GOLD Preci-Dip |
3,708 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 181 (15 x 15) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
116-41-304-41-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,694 | - |
RFQ |
Scheda tecnica |
Tube | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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